Semiconductor Pad Segmentation for Probe Testing
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Solution Overview
Problem
The existing semiconductor device testing methods often cause damage to test pads and result in metal flakes adhering to probes, limiting the repetitive use of probes due to the direct probing technique.
Innovation Solution
The semiconductor assembly design includes a signal pad with a primary portion and a subsidiary portion, where the subsidiary portion has hollows extending parallel to the device area, allowing probes to be slid along these hollows for testing without damaging the primary portion, which is then mounted upside down on a support, preventing scratches and reducing metal flake adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If direct probing to the test pads is performed, then testing of the semiconductor device can be carried out, but damage to the pads occurs and metal flakes adhere to the probes
Solution Approach 1:
The signal pad is divided into two distinct portions: a primary portion for mounting and electrical connection, and a subsidiary portion with hollows for testing. This segmentation allows the testing function to be separated from the functional pad area, enabling probing without damaging the primary signal pad while maintaining testing capability through the subsidiary portion.
Solution Approach 2:
The subsidiary portion with hollows acts as an intermediary testing structure. The probe interacts with the hollows rather than directly with the solid pad metal, which prevents direct metal-to-metal contact that causes damage and flake generation. The hollows provide a geometric feature that facilitates probing while protecting the underlying pad structure.
2Measurement precision
If probes are used for testing, then semiconductor device performance can be evaluated, but repetitive use of probes is restricted due to flake adherence
Solution Approach 1:
By separating the testing function into a dedicated subsidiary portion with hollows, the probe only interacts with the hollow structure rather than solid metal pads. This reduces metal flake generation during probing, allowing probes to be reused multiple times without contamination, thereby improving productivity and probe reuse capability.
3Reliability
If the semiconductor device is tested before dicing and assembling, then electrical performance can be verified, but pad damage occurs during the probing process
Solution Approach 1:
The pad structure is segmented into a primary portion that maintains full structural integrity for mounting and signal transmission, and a subsidiary portion with hollows that is specifically designed for testing. This allows wafer-level testing to be performed on the subsidiary portion without compromising the strength and integrity of the primary signal pads.
Solution Approach 2:
The hollows in the subsidiary portion serve as an intermediary testing interface that protects the underlying pad metal from direct probe contact. This intermediary structure enables electrical performance verification while preventing mechanical damage to the pad integrity during the probing process.
Data Source
AI summary
A semiconductor device having a composite pad including a primary portion and a subsidiary portion is disclosed. The primary portion is provided for electrical connection to an internal circuit of the semiconductor device. The subsidiary portion is provided for probing, in particular, for testing high frequency performance of the semiconductor device by probing with a RF-probe. Because the subsidiary portion is independent from the primary portion, the subsidiary portion does not affect the electrical performance of the semiconductor device. Also, the subsidiary portion has a narrowed contact area with respect to the RF-probe to lessen adherence of metal flakes from the pad onto the probe.