Semiconductor Pad with Integrated Sensing Area for Alignment Verification
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Solution Overview
Problem
Current semiconductor devices face challenges in reducing size while increasing data processing capacity and integration, particularly in accurately verifying probe alignment for testing purposes, as they often require separate sensor pads and normal pads, which can complicate design and increase size.
Innovation Solution
The semiconductor device incorporates a pad arrangement with a first pad having a contact area and a sensing area, where the sensing area is electrically isolated and adjacent to the contact area, allowing the same pad to function as both a sensor pad for verifying alignment and a normal pad for signal supply, eliminating the need for a dedicated sensor pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate sensor pads and normal pads are used for verifying probe alignment, then alignment verification accuracy is improved, but device size increases and integration is reduced
Solution Approach 1:
The patent combines the sensor pad and normal pad into a single integrated pad structure. The pad includes a contact area for signal transmission and a sensing area for alignment verification, merging two previously separate functions into one unified component. This eliminates the need for separate sensor pads while maintaining alignment verification capability.
Solution Approach 2:
The integrated pad serves multiple functions simultaneously: it acts as both a signal transmission pad and an alignment sensing pad. The pad structure is designed to perform dual roles, allowing the same physical component to verify probe alignment and transmit electrical signals, thereby reducing the total number of pads required.
2Measurement precision
If separate sensor pads and normal pads are used for verifying probe alignment, then alignment verification accuracy is improved, but device complexity increases
Solution Approach 1:
The patent combines the sensor pad and normal pad into a single integrated pad structure. The pad includes a contact area for signal transmission and a sensing area for alignment verification, merging two previously separate functions into one unified component. This eliminates the need for separate sensor pads while maintaining alignment verification capability.
Solution Approach 2:
The integrated pad serves multiple functions simultaneously: it acts as both a signal transmission pad and an alignment sensing pad. The pad structure is designed to perform dual roles, allowing the same physical component to verify probe alignment and transmit electrical signals, thereby reducing the total number of pads required.
3Area of stationary object
If a single pad performs dual functions as both sensor pad and normal pad, then device size is reduced and integration is improved, but pad design complexity increases
Solution Approach 1:
The integrated pad is divided into distinct functional regions: a contact area for signal transmission and a sensing area for alignment verification. This segmentation allows each region to perform its specific function while being part of a unified pad structure, managing complexity through functional zoning.
Solution Approach 2:
Different regions of the pad have different properties and functions. The contact area is optimized for electrical connection while the sensing area is optimized for alignment detection. This local differentiation allows the pad to perform multiple functions with each region specialized for its specific purpose.
Data Source
AI summary
A semiconductor device includes a plurality of semiconductor devices, a plurality of metal lines electrically connected to at least one of the semiconductor devices, and a protective layer on the metal lines. The protective layer includes a plurality of open areas partially exposing the metal lines and which serves as pads. A first pad includes a first area that extends from at least one of the metal lines and at least one second area around and separated from the first area.