Semiconductor Structure With Optimized Pad Spacing
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Solution Overview
Problem
The complexity of manufacturing and integration of semiconductor devices leads to issues such as poor electrical interconnection and interference due to increased complexity in low-profile and high-density configurations, resulting in deficiencies like capacitance that affect the output signal.
Innovation Solution
A semiconductor structure design featuring a substrate with conductive traces, a chip with edge and central pads, and bonding wires, where the distance between edge pads and the chip's sidewall is optimized to reduce capacitance, with specific alignment and connection configurations of power and signal lines, and bonding wires to improve signal output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor devices are integrated in low-profile and high-density configurations, then functionality and integration amount increase, but manufacturing complexity increases and electrical interconnection quality deteriorates
Solution Approach 1:
The chip is divided into distinct functional zones: a central area containing central pads for signal processing, and an edge area containing edge pads for electrical connection. This segmentation allows optimized routing where signal lines remain short in the central area while power lines can extend to edge pads, reducing overall signal path length and interference.
Solution Approach 2:
The patent utilizes both two-dimensional pad placement on the chip surface and three-dimensional wiring (signal lines and power lines extending in vertical and horizontal directions) to create efficient electrical pathways. This multi-dimensional approach allows short signal paths while accommodating power distribution requirements.
2Adaptability or versatility
If manufacturing and integration steps are increased to achieve high-density configuration, then device functionality improves, but electrical interconnection quality deteriorates due to interference
Solution Approach 1:
Different regions of the chip are assigned different functions: the central area is optimized for signal processing with central pads and short signal lines, while the edge area handles power connection with edge pads. This local optimization ensures that signal lines remain short and isolated from interference-prone areas, improving electrical interconnection reliability.
Solution Approach 2:
Power lines serve as intermediaries that carry power from edge pads to central pads without interfering with signal lines. The separation of power and signal pathways, with power lines acting as dedicated mediators, prevents electrical interference and maintains signal integrity.
3Reliability
If edge pads are positioned closer to the chip sidewall, then capacitance decreases and signal output improves, but manufacturing precision requirements increase
Solution Approach 1:
The chip is segmented into a central area with central pads and an edge area with edge pads positioned close to the sidewall. This segmentation allows edge pads to be optimally positioned for low capacitance while central pads maintain signal integrity, with the manufacturing process designed to accommodate this divided layout.
Data Source
AI summary
A semiconductor structure includes a substrate, a chip, a first edge pad, a first central pad, a second edge pad, and a second central pad. The substrate has a first surface and a conductive trace extending above the substrate. The chip is above the first surface of the substrate, and has a sidewall, a central area, and an edge area. The first edge pad is on the edge area. The first central pad is on the central area and electrically connected to the first edge pad. The second edge pad is on the edge area of the chip. A distance between the first edge pad and the sidewall of the chip is substantially smaller than a distance between the second edge pad and the sidewall of the chip. The second central pad is on the central area of the chip and electrically connected to the second edge pad.