Semiconductor Package Pad Structure for Stable Chip Connections
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Solution Overview
Problem
Semiconductor packages face challenges in reliably achieving multifunctionality and high performance due to difficulties in effectively packaging semiconductor chips.
Innovation Solution
A semiconductor package design featuring a redistribution substrate with a lower and upper insulating layer, a pad structure with a hemispherical pad portion and via portion, and a connection member to enhance electrical connectivity and stability between the semiconductor chip and the redistribution substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor package structure is used, then the structure is simple, but it cannot reliably achieve multifunctionality and high performance
Solution Approach 1:
The package structure is segmented into distinct functional layers: lower insulating layer, upper insulating layer, pad structure with hemispherical pad portion, and connection members. This segmentation allows each component to be optimized independently for its specific function while contributing to overall reliability.
Solution Approach 2:
The pad portion is designed with a hemispherical shape instead of a conventional flat or cylindrical form. This curvature increases the contact area between the pad portion and connection members, thereby improving connection reliability and electrical performance without significantly increasing overall package complexity.
2Stability of the object's composition
If the contact area between pad structure and connection member is increased, then connection stability is improved, but manufacturing complexity increases
Solution Approach 1:
The hemispherical pad portion is formed through a controlled plating process that naturally creates the curved shape. This approach achieves increased contact area and connection stability while using standard semiconductor manufacturing techniques, avoiding excessive manufacturing complexity.
Solution Approach 2:
The pad portion's hemispherical shape and its dimensional parameters are optimized to provide sufficient contact area for stable connections. By carefully controlling the radius and height of the hemispherical pad, the design achieves reliable connections without requiring overly complex manufacturing processes.
Data Source
AI summary
A semiconductor package includes: a redistribution substrate including a lower insulating layer, a redistribution via penetrating through the lower insulating layer, a redistribution layer connected to the redistribution via on the lower insulating layer, and an upper insulating layer on the lower insulating layer and having a first surface and a second surface opposing the first surface; a pad structure including a pad portion, disposed on the first surface of the redistribution substrate, and a via portion penetrating through the upper insulating layer to connect the redistribution layer and the pad portion to each other; a semiconductor chip disposed on the first surface of the redistribution substrate and including a pad; and a connection member in contact with the pad portion and the pad of the semiconductor chip between the pad structure and the pad of the semiconductor chip. The pad portion of the pad structure has a hemispherical shape, and a side surface of the via portion of the pad structure is in contact with the upper insulating layer.