Semiconductor Module Pad Layout for Post-Mount Temperature Calibration
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Solution Overview
Problem
Existing semiconductor modules face challenges in maintaining accurate temperature detection due to variations in diode temperature characteristics, which can change after mounting, and existing correction methods are costly or prone to measurement inaccuracies.
Innovation Solution
A semiconductor module design with a pad configuration and manufacturing method that allows for accurate measurement and correction of diode temperature characteristics post-mounting, using a measurement device and laser trimming of a fuse circuit to adjust the reference voltage, without requiring nonvolatile memory, thereby improving temperature detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If temperature characteristics of the diode are measured before the semiconductor chip is mounted, then measurement can be performed easily, but the temperature characteristics may change due to stress effects after mounting
Solution Approach 1:
The pad is designed with extra area in advance to accommodate both wire bonding and probe measurement after mounting. This preliminary design enables post-mounting measurement without compromising the semiconductor chip's temperature characteristics, thus resolving the contradiction between ease of measurement and measurement accuracy.
2Measurement precision
If a nonvolatile memory such as EEPROM is used for correction, then temperature characteristics can be corrected accurately, but the cost increases
Solution Approach 1:
The invention uses a simple pad structure and wire bonding approach instead of expensive nonvolatile memory devices. The correction is achieved through the mounting board's pad design that enables accurate measurement and compensation without requiring costly EEPROM or other nonvolatile memory components, thus resolving the contradiction between measurement precision and device complexity.
3Area of stationary object
If the pad area is exactly the sum of wire bonding area and probe contact area, then space is optimized, but measurement interference and coupling errors occur
Solution Approach 1:
The pad is segmented into distinct functional areas: a wire bonding area and a probe contact area. This segmentation prevents interference between the wire and probe during measurement, ensuring accurate forward voltage measurement of the diode while optimizing the use of pad area.
Solution Approach 2:
Different regions of the pad are assigned different functions with appropriate local characteristics. The wire bonding area is optimized for electrical connection, while the probe contact area is optimized for measurement access. This local differentiation eliminates coupling errors and measurement interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy of temperature detection by accounting for post-mounting changes in diode characteristics, reducing costs associated with nonvolatile memory usage, and preventing measurement interference and coupling errors.
Implementation Method 1
a forward voltage of the diode being measurable by a probe of the measurement device
Implementation Method 2
a trimming step of performing laser trimming on the fuse circuit of the integrated circuit based on the measurement data
Data Source
AI summary
A semiconductor module with temperature characteristics adjustable through a measurement device. The semiconductor module includes a mounting board having a semiconductor chip and an integrated circuit mounted thereon. The semiconductor chip includes a switching device and a diode for temperature detection, a forward voltage of the diode being measurable by the measurement device. The integrated circuit includes a correction circuit that generates a corrected reference voltage, and a control circuit that receives the corrected reference voltage and a drive signal, and controls the switching device based on the corrected reference voltage and the drive signal. The mounting board includes a pad to be coupled to the diode with a wire. The pad has an area larger than a sum of a first area to be coupled to the wire and a second area to be in contact with the probe of the measurement device for measuring the forward voltage.