Semiconductor Package Pad Layout for Dense Terminal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in circuit integration and signal transmission due to limited space, increased number of terminals, and deteriorating signal characteristics as trace lengths increase, leading to reduced performance and reliability.
Innovation Solution
A semiconductor package with an insulating layer and electrode portion featuring pads with curved and straight portions, optimized widths, and traces to enhance electrical and physical reliability, allowing multiple semiconductor devices to be mounted side by side within a limited space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of mounting pads is increased to accommodate more terminals, then the number of connected terminals increases, but the substrate area becomes insufficient and trace length increases
Solution Approach 1:
The patent transitions from a two-dimensional substrate layout to a three-dimensional structure by forming pads that extend in the vertical direction (thickness direction) with side surfaces. This allows the pad area to be effectively increased without proportionally increasing the substrate footprint, enabling more pads to be accommodated in limited space while maintaining short trace lengths.
Solution Approach 2:
The pad structure is designed with nested layers including a bottom surface, side surfaces, and a top surface, where the side surfaces extend vertically between the bottom and top surfaces. This nested three-dimensional configuration maximizes the utilization of substrate volume, allowing increased pad capacity within the same planar area.
2Quantity of substance
If the number of mounting pads is increased, then more terminals can be connected, but the circuit integration degree deteriorates
Solution Approach 1:
By extending pads vertically with side surfaces, the patent increases pad capacity without proportionally increasing the number of required interconnections on the substrate surface. This three-dimensional configuration maintains simpler circuit integration while accommodating more terminals.
3Quantity of substance
If the number of mounting pads is increased, then more terminals can be connected, but signal transmission characteristics deteriorate due to increased trace length
Solution Approach 1:
The vertical extension of pads with side surfaces reduces the horizontal distance between adjacent pads, thereby shortening trace lengths and improving signal transmission characteristics while accommodating more terminals.
Data Source
AI summary
A semiconductor package according to an embodiment comprises an insulating layer; and an electrode portion disposed on the insulating layer, wherein the electrode portion includes a plurality of pads and a trace connecting the plurality of pads, and wherein the plurality of pads includes a first pad including a curved portion in a circumference of an upper surface has a specific radius of curvature and a straight portion connected to the curved portion; and a second pad that does not include a straight portion in a circumference of an upper surface facing the curved portion of the first pad.