Semiconductor Pad Structure for Void-Controlled Resin Encapsulation
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Solution Overview
Problem
The reliability of electrical connections between the wiring substrate and semiconductor element in semiconductor devices is compromised due to the formation of voids in the encapsulation resin, leading to potential short circuits between adjacent connection pads.
Innovation Solution
The semiconductor device incorporates connection pads with first and second projections and recesses, forming a closed first space that facilitates the formation of a void within the encapsulation resin, thereby restricting resin flow to adjacent gaps and preventing short defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation resin is used to protect the electrical connection between wiring substrate and semiconductor element, then protection and insulation are improved, but voids may form in the resin leading to potential short circuits
Solution Approach 1:
The connection pad structure is segmented into multiple regions including a first recess and second recess that create distinct spaces. These segmented structures guide resin flow and control void formation locations, preventing voids from causing short circuits between adjacent pads
Solution Approach 2:
The connection pad structure is designed in advance with predetermined recesses and spaces that guide resin flow patterns before encapsulation. This preliminary structural design ensures that voids form only in non-critical areas away from electrode pads, preventing short circuits
2Strength
If encapsulation resin is applied to fill the space between wiring substrate and semiconductor element, then structural support and protection are improved, but resin flow may cause short circuits between adjacent connection pads
Solution Approach 1:
Different regions of the connection pad structure have different properties: some areas have recesses that accept resin, while other areas have elevated portions that resist resin flow. This local differentiation ensures structural support while preventing resin from causing short circuits between adjacent pads
Data Source
AI summary
A semiconductor device includes a wiring substrate, a semiconductor element, a bonding member bonding connection pads of the wiring substrate and electrode pads of the semiconductor element, and an encapsulation resin provided between the wiring substrate and the semiconductor element. The connection pads each include a first body, first projections projecting from the first body toward a central region of the semiconductor element, and a first recess. The bonding members each include a second body, second projections projecting from the second body toward the central region, and a second recess. A first space surrounded by the upper surface of the substrate body, the wall surface of the first recess, the wall surface of the second recess, and the lower surface of each of the electrode pads is open in a single direction.