Semiconductor Pad Wiring Layout for Reduced Coupling
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Solution Overview
Problem
In high-performance semiconductor devices, the fine pitch wiring patterns between semiconductor chips lead to signal deterioration due to coupling effects, particularly in vertical routing wirings with narrow gaps, which affects signal characteristics.
Innovation Solution
The semiconductor device employs wiring patterns with adjustable angles and gaps between pads and peripheral pads on a substrate, minimizing vertical routing lengths and reducing coupling effects by varying the horizontal and vertical gaps and extension angles of the wiring patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vertical routing wirings with narrow gaps are used to connect pads, then wiring density is improved, but signal characteristics deteriorate due to coupling effects
Solution Approach 1:
The patent applies asymmetry by making the vertical gap between adjacent wiring patterns different from the horizontal gap. Specifically, the vertical gap is designed to be larger than the horizontal gap, creating an asymmetric gap configuration that reduces coupling effects between adjacent wirings while maintaining high wiring density through the use of angled extension portions.
Solution Approach 2:
The patent introduces angled extension portions that extend in directions other than purely horizontal or vertical. These extension portions are configured at angles (e.g., 45 degrees or other oblique angles) relative to the horizontal direction, adding a dimensional component that allows wirings to connect pads while reducing parallel alignment and coupling effects.
2Reliability
If wiring patterns with larger vertical gaps are used, then coupling effects are reduced, but wiring length increases
Solution Approach 1:
The patent uses angled extension portions that connect pads by extending in oblique directions rather than purely vertical directions. This dimensional change allows the wiring to achieve connection while utilizing the horizontal spacing between pads, thereby reducing the required vertical gap length and minimizing overall wiring length while still maintaining reduced coupling effects.
Solution Approach 2:
The wiring patterns incorporate curved or angled extension portions instead of straight vertical lines. These extension portions are configured to extend at angles (such as 45 degrees or other oblique angles) relative to the horizontal direction, creating a curved path that reduces coupling effects while optimizing wiring length by utilizing both horizontal and vertical spacing.
Data Source
AI summary
A semiconductor device includes pads of a first group and a plurality of first peripheral pads, which are adjacent to each other and spaced apart by a first horizontal gap in a first direction, and pads of a first group and a plurality of first peripheral pads, which are connected to each other and spaced apart by a first vertical gap, greater than the first horizontal gap, in a second direction. A plurality of first wiring patterns include first horizontal extension portions extending at an angle exceeding about 45 degrees with respect to the first direction within the first horizontal gap.