Semiconductor Packaging Panel Flattening With an Electroactive Carrier
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Solution Overview
Problem
Panel warpage in semiconductor device packaging poses challenges during encapsulation and redistribution, affecting yield, reliability, and handling costs due to differing thermal expansion coefficients of materials.
Innovation Solution
A reusable warpage control carrier with electroactive elements is used, attached to the panel via a thermal releasable adhesive, and controlled with voltages to flatten the panel, allowing for precise warpage management and subsequent planar-sensitive processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If panel-level packaging is used to reduce costs and improve efficiency, then productivity and cost-effectiveness are improved, but panel warpage occurs during encapsulation and redistribution processes
Solution Approach 1:
The patent applies preliminary action by attaching a carrier substrate to the panel before encapsulation and redistribution processes. This carrier substrate provides mechanical support and maintains panel flatness during subsequent processing steps, preventing warpage from occurring in the first place rather than correcting it after the fact.
Solution Approach 2:
The carrier substrate acts as an intermediary element between the panel and the processing equipment. It transfers mechanical support and stability to the panel during encapsulation and redistribution, allowing the panel to maintain its flatness without directly interacting with the processing tools that could cause warpage.
2Device complexity
If encapsulation and redistribution processes are performed on warped panels, then manufacturing complexity is reduced, but yield and reliability deteriorate due to difficult connection formation
Solution Approach 1:
The patent maintains panel flatness through the carrier substrate throughout the encapsulation and redistribution processes, ensuring that connection formation occurs on a flat surface. This preliminary maintenance of flatness enables reliable connections without adding complex warpage correction steps during the actual connection formation process.
3Device complexity
If panel warpage is allowed to occur naturally during processing, then device complexity is minimized, but handling costs and reliability worsen
Solution Approach 1:
The carrier substrate is attached before processing to prevent warpage, eliminating the need for complex warpage measurement and correction equipment. This preliminary support structure provides a simple yet effective solution that reduces handling costs by preventing warpage-related defects and rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively flattens the panel, enabling improved yield, reliability, and cost-effectiveness by facilitating precise control over warpage, thereby enhancing panel handling and processing.
Implementation Method 1
A reusable warpage control carrier is provided including a plurality of electroactive elements configured to substantially flatten a semiconductor device packaging panel
Implementation Method 2
The warpage control carrier is joined with the panel by way of a thermal releasable adhesive
Data Source
AI summary
A method of manufacturing a semiconductor device packaging panel is provided. The method includes forming a panel having an active side and a backside. The panel includes a plurality of semiconductor die encapsulated with an encapsulant. An active surface of the semiconductor die is exposed on the active side of the panel. A warpage control carrier is attached onto the backside of the panel. The warpage control carrier includes an electroactive element configured for substantially flattening the panel while a control voltage is applied to the electroactive element.