Semiconductor Panel Grooves for Vacuum Stability

The patent applies preliminary stress relief processing before the panel becomes excessively warped. By performing stress relief operations at an early stage in the manufacturing process, the panel is prevented from developing severe warpage that would later require alternative processing methods. This preliminary action maintains panel flatness while still achieving the necessary device functionality through subsequent high-temperature processes.

The patent introduces a stress relief structure as an intermediary element between the panel and the vacuum support system. This structure mediates the interaction by providing a mechanism to relieve warpage-induced stresses, enabling the conventional tape-less support structure to maintain reliable vacuum attachment even when panels have undergone high-temperature processing. The intermediary structure allows the simple support system to function effectively without requiring complex modifications.

The patent performs stress relief processing as a preliminary operation before panels become excessively warped. By addressing warpage early in the manufacturing sequence, the panel remains processable on high-speed automated equipment throughout subsequent operations including solder printing and singularization. This prevents the need to switch to alternative, less efficient process flows, thereby maintaining manufacturing productivity and cost-effectiveness.

The stress relief structure acts as an intermediary that enables consistent spacing between the warped substrate and the stencil during solder paste application. By relieving warpage-induced stresses, the structure allows the substrate to maintain adequate contact with the stencil across the entire panel surface, ensuring uniform solder paste deposition even when the overall panel shape is not perfectly flat. This intermediary mechanism preserves manufacturing precision without requiring complete substrate flatness.