Semiconductor Parameter Adjustment for Exposure Device Consistency
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Solution Overview
Problem
In semiconductor manufacturing, the increasing precision of microfabrication processes makes it challenging to maintain consistent performance across different manufacturing devices, particularly exposure devices, due to minute variations in parameters like polarization, numerical aperture, and lens aberration, which affect the finished shape on wafers, requiring a method to quantify and adjust these parameters effectively.
Innovation Solution
A parameter adjustment method that involves setting a reference parameter range for a reference manufacturing device, calculating the difference in finished shapes between this device and other manufacturing devices, and iteratively adjusting parameters until the difference meets a predetermined reference value, ensuring consistent output across devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If microfabrication precision is increased to achieve smaller minimum processing sizes, then manufacturing capability is improved, but performance variation between manufacturing devices increases
Solution Approach 1:
The invention changes the parameters of manufacturing devices (exposure devices) by automatically adjusting multiple parameters such as light shape, numerical aperture, and aberration based on simulation results. This ensures that each device's parameters are optimized to minimize performance variation while maintaining the advanced microfabrication precision required for smaller processing sizes.
Solution Approach 2:
The invention implements a feedback mechanism where the actual performance of each manufacturing device is measured and compared against target values. The parameter adjustment apparatus then automatically adjusts device parameters based on this feedback, creating a closed-loop system that continuously reduces performance variation between devices while maintaining high manufacturing precision.
2Manufacturing precision
If the number of adjustable parameters is increased to control minute variations, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The parameter adjustment apparatus automatically performs the complex task of adjusting multiple device parameters without requiring manual intervention for each parameter. The system self-manages the optimization process by using simulation data and actual measurement data to automatically determine the optimal settings for light shape, numerical aperture, aberration, and other parameters, thereby reducing the burden on operators while achieving precise control.
Solution Approach 2:
The invention performs preliminary simulation before actual manufacturing to predict the optimal parameter settings. By conducting lithography simulations and optical proximity effect corrections in advance, the system determines the ideal parameters for each device before production begins, allowing for precise control of minute variations without the complexity of real-time manual adjustment during manufacturing.
3Manufacturing precision
If parameter specifications are tightened to maintain consistent performance, then manufacturing precision is improved, but ease of operation deteriorates
Solution Approach 1:
The invention replaces manual parameter adjustment and optimization with an automated computer-based system. The parameter adjustment apparatus uses software to perform simulations, analyze data, and automatically adjust device parameters, substituting the mechanical/manual process with an automated electronic system. This maintains tight parameter specifications while eliminating the operational difficulty of manually satisfying complex specifications.
Data Source
AI summary
A parameter adjustment method for a plurality of manufacturing devices to form a pattern of a semiconductor device on a substrate using the manufacturing devices includes: adjusting a parameter adjustable for a manufacturing device serving as a reference manufacturing device; obtaining a first shape of a pattern of a semiconductor device to be formed on a substrate; defining an adjustable parameter of another to-be-adjusted manufacturing; obtaining a second shape of the pattern formed on the substrate; calculating a difference amount between a reference finished shape and a to-be-adjusted finished shape; repeatedly calculating the difference amount by changing the to-be-adjusted parameter until the difference amount becomes equal to or less than a predetermined reference value; and outputting as a parameter of the to-be-adjusted manufacturing device the to-be-adjusted parameter.


