Semiconductor Device Partial Sealing Resin LED Mounting
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Solution Overview
Problem
Existing semiconductor devices with molding resin face limitations in product shape flexibility and reliability due to the need for additional processes like mounting LEDs after resin sealing, which can introduce heat stress and restrict shape design.
Innovation Solution
A semiconductor device configuration where a non-sealed region on the board allows for the exposure of components like LEDs outside the sealing resin, enabling simultaneous mounting with passive components during the reflow process, reducing heat stress and maintaining shape flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components like LEDs are mounted after resin sealing, then the device can be sealed and protected, but additional post-sealing processes are required which increase manufacturing complexity and heat stress
Solution Approach 1:
The patent applies preliminary action by mounting the LED component on the board before the resin sealing process. This allows the component to be positioned and secured in advance, eliminating the need for additional post-sealing mounting processes. The LED is mounted on the exposed board region, and then the resin is applied to seal the device, completing both protection and component integration in a single manufacturing flow.
2Adaptability or versatility
If additional post-sealing mounting processes are used, then components can be added after sealing, but heat stress is introduced which reduces reliability
Solution Approach 1:
The patent performs the component mounting action before the sealing process, thereby avoiding subsequent heat-based mounting operations that would stress the sealed device. The LED is soldered to the board in the same manufacturing stage as other components, and the resin sealing is applied afterward, preventing any thermal or mechanical stress to the completed sealed structure.
3Reliability
If the entire board surface is sealed with resin, then maximum protection is achieved, but shape design flexibility is restricted
Solution Approach 1:
The patent applies local quality by creating a partial sealing structure where only specific regions of the board are covered with resin. The board has an exposed region where components like LEDs are mounted, and a sealed region where the resin provides protection. This localized sealing approach allows the device to maintain both protection for critical areas and shape flexibility for external components, eliminating the need for complete encapsulation.
4Shape
If components are mounted after sealing, then shape design is constrained, but manufacturing simplicity is maintained
Solution Approach 1:
The patent performs preliminary mounting of components on the board before the resin sealing process. This sequence allows the device to achieve flexible shape design through exposed board regions while maintaining manufacturing simplicity, as the component mounting and sealing operations are integrated into a single continuous process flow without requiring additional post-sealing steps.
Data Source
AI summary
According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.