Semiconductor Patch Clamp for Automated Cell Capture
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Solution Overview
Problem
Existing patch clamp technologies require specialized skills, are time-consuming, and have low yield, and are sensitive to environmental changes, limiting their ability to efficiently capture and measure ion currents and voltages from multiple cells.
Innovation Solution
A pipette type patch clamp manufactured using a semiconductor process, featuring a puller with a through region, a silicon wafer, an insulating layer, and an electrode layer, which can automatically capture cells and measure ion currents and voltages without specialized skills, by forming a pipette shape through reflow processes and coupling with PDMS fluid channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a traditional manual patch clamp method is used, then specialized skill and sophisticated equipment are required, but the operation is time-consuming and applicable only to single or very few cells
Solution Approach 1:
The patch clamp device is designed to automatically capture cells through its suction capability without requiring manual manipulation. The device serves itself by using its own suction force to draw cells into the measurement chamber, eliminating the need for specialized manual skills and reducing operation time significantly
Solution Approach 2:
The manual mechanical attachment process is replaced with an automated suction-based capture mechanism. The suction force generated by the device itself replaces the need for manual glass microtube attachment, enabling automatic cell capture and significantly reducing operation time
2Productivity
If traditional patch clamp manufacturing is used, then two patch clamps are manufactured at a time, but the yield is low and external condition changes cause shape variations
Solution Approach 1:
The manufacturing process uses controlled parameter changes during the glass blowing and cooling stages to ensure consistent shape reproduction. By precisely controlling temperature, pressure, and cooling rates during manufacturing, the device achieves high shape consistency and high yield without being affected by external environmental changes
Solution Approach 2:
The glass material undergoes phase transitions during manufacturing (melting, forming, cooling) that are precisely controlled to produce consistent shapes. The phase change process allows for precise shape definition that remains consistent across multiple units, improving both yield and manufacturing precision
3Productivity
If manual attachment of glass microtube to cell is required, then specialized skill is needed, but this limits the ability to process multiple cells efficiently
Solution Approach 1:
The patch clamp device is designed with multi-functionality to handle multiple cells efficiently. The same device structure serves both single-cell and multi-cell measurement capabilities, with the suction mechanism able to process multiple cells sequentially or in parallel, significantly improving throughput without requiring multiple specialized devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast, automatic, and accurate measurement of ion currents and voltages from multiple cells with high sealing resistance and high throughput, reducing the need for specialized skills and improving manufacturing efficiency.
Implementation Method 1
a puller having a through region with a predetermined length such that an object may be sucked therethrough
Implementation Method 2
The puller may be formed in a shape of a pipette through a plurality of reflow processes
Data Source
AI summary
Disclosed are a pipette type patch clamp, a measuring device having the patch clamp, and a method of manufacturing the patch clamp. The pipette type patch clamp includes a pipette type puller having a through region with a predetermined length such that an object is sucked therethrough, a silicon wafer configured to support the puller, an insulating layer disposed on a surface of the silicon wafer and a surface of the puller, and an electrode layer disposed on a surface of the insulating layer to connect to a first fluid channel and a second fluid channel.