Semiconductor Circuit Patterns With Discrimination Marks for Defect Mapping
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Solution Overview
Problem
In the manufacturing of semiconductor devices, it is challenging to accurately determine the position of defects or manufacturing issues within the complex circuit patterns, particularly when the same pattern is repeatedly formed on a substrate, making it difficult to associate the observed image with the corresponding design data.
Innovation Solution
The semiconductor device incorporates a discrimination pattern within the circuit pattern, featuring distinct shapes that allow for the differentiation of individual unit patterns. This discrimination pattern enables easy correlation between the observed image and the design data, facilitating the identification of defects and manufacturing issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the same pattern is repeatedly formed on a substrate to improve productivity, then manufacturing efficiency is improved, but it becomes difficult to determine which part of the design data the observed image corresponds to
Solution Approach 1:
The patent divides the repeatedly formed patterns into distinguishable units by introducing unique discrimination patterns (such as alignment marks or identification patterns) at specific locations. This segmentation allows each repeated unit to be individually identified and correlated with its corresponding position in the design data, solving the problem of losing position information while maintaining high productivity through repeated patterning.
2Reliability
If observation is performed to detect manufacturing problems, then product quality is improved, but it is difficult to associate the observed image with the corresponding design data when patterns are repeated
Solution Approach 1:
The patent introduces discrimination patterns as intermediary elements that serve as reference markers between the observed image and the design data. These intermediaries (alignment marks, identification patterns) provide a common reference system that facilitates accurate correlation and position matching, reducing the complexity of associating observed defects with their corresponding design locations.
3Productivity
If position information is accurately determined for defects, then product yield is improved, but it requires additional discrimination patterns that increase device complexity
Solution Approach 1:
The patent applies local quality by placing discrimination patterns only at specific strategic locations (such as corners, edges, or key reference points) rather than throughout the entire device. This localized approach provides sufficient position information for defect identification and yield improvement while minimizing the additional complexity introduced by discrimination patterns, maintaining circuit density in the majority of the device area.
Data Source
AI summary
According to one embodiment, a semiconductor device includes a circuit pattern including a plurality of unit patterns that are disposed in a repeating manner in at least one direction. The semiconductor device includes a discrimination pattern provided in the circuit pattern and configured to discriminate the unit patterns from each other.