Semiconductor Pattern Inspection Using Angular and Non-Linear Part Segmentation
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Solution Overview
Problem
Conventional pattern inspection methods for semiconductor devices are inefficient and prone to erroneous defect detection due to the use of ideal CAD data, which fails to accurately distinguish between non-linear and angular parts, leading to false positives and difficulties in precise positioning.
Innovation Solution
A pattern inspection apparatus that extracts contour data from captured images and compares it with angular parts from design data, using non-linear and angular part extraction sections to detect defects by identifying corresponding points and directions, thereby reducing false positives and improving accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If design data (CAD) is used as reference pattern for automated inspection, then inspection time is reduced and automation is improved, but erroneous detection occurs because ideal CAD shapes do not match actual manufactured patterns
Solution Approach 1:
The patent segments the pattern comparison process into two distinct parts: angular parts (from design data) and non-linear parts (from actual captured images). By dividing the reference pattern into these two types, the system can compare each type appropriately - angular parts provide automated positioning references while non-linear parts capture actual manufactured characteristics, thus resolving the contradiction between automation and accuracy
Solution Approach 2:
The patent applies different qualities to different parts of the pattern: angular parts are extracted from ideal design data for automated positioning, while non-linear parts are extracted from actual captured images to reflect manufacturing realities. This local differentiation allows the system to maintain both automation benefits and detection accuracy
2Device complexity
If simple difference value comparison is used between design data and captured image, then processing is simplified, but false defect detection occurs at angular parts that cannot be reproduced in manufacturing
Solution Approach 1:
The patent divides the pattern into angular parts and non-linear parts, comparing them differently. Angular parts from design data are used for positioning without expecting exact reproduction, while non-linear parts from captured images are compared to detect actual defects. This segmentation prevents false detections while maintaining processing efficiency
Solution Approach 2:
Instead of comparing the entire pattern including angular parts that cannot be reproduced, the patent inverts the approach by extracting angular parts from design data solely for positioning purposes, and comparing only non-linear parts for defect detection. This inversion eliminates false positives while keeping processing simple
Data Source
AI summary
There is provided a pattern inspection apparatus that is capable of detecting a defect accurately and efficiently to inspect a pattern of a semiconductor device. The pattern inspection apparatus includes: a contour extraction means for extracting contour data of a pattern from a captured image of the semiconductor device; a non-linear part extraction means for extracting a non-linear part from the contour data; an angular part extraction means for extracting an angular part of a pattern from design data of the semiconductor device; and a defect detection section that compares a position of the non-linear part extracted by the non-linear part extraction section with a position of the angular part extracted by the angular part extraction section so as to detect a position of a defective part of a pattern.