Semiconductor Device Pattern Layer Between Joint Member Portions
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Solution Overview
Problem
The existing semiconductor devices with color filter layers require additional monitor pixels or patterns that do not function as effective pixels, leading to increased device size and potential deterioration of semiconductor characteristics, necessitating a miniaturized design.
Innovation Solution
A semiconductor device design featuring a color filter layer over an effective pixel region and a pattern layer with the same material, positioned between separate portions of a joint member, allowing for miniaturization without additional space requirements and enhancing joining reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If monitor pixels or patterns are arranged outside the effective pixel region, then the color filter layer can be checked and quality managed, but the semiconductor device size increases
Solution Approach 1:
The patent combines the pattern layer with the joint member structure, placing the pattern layer on the joint member rather than on a separate substrate area. This merging of functions allows the pattern layer to serve both as a structural component of the joint member and as a region for optical measurements, thereby eliminating the need for additional space outside the effective pixel region.
Solution Approach 2:
The joint member is designed to serve multiple functions: it provides mechanical support for joining substrates, and simultaneously serves as a carrier for the pattern layer that enables transmission spectrometric measurement. This multi-functionality allows the same structure to fulfill both structural and measurement purposes without requiring additional dedicated space.
2Area of stationary object
If the pattern layer is disposed between portions of the joint member, then miniaturization is achieved, but the joining reliability must be maintained
Solution Approach 1:
The joint member is divided into multiple portions with spaces between them, and the pattern layer is disposed in these spaces. This segmentation allows the pattern layer to be integrated into the joint member structure without interfering with the joining function, as the pattern layer is positioned in the gaps between the functional portions of the joint member.
Data Source
AI summary
A semiconductor device includes a first substrate, a semiconductor device includes a first substrate, a color filter layer over the first substrate in an effective pixel region, a second substrate over the color filter layer, a joint member joining the first and second substrates, and a pattern layer over the first substrate outside the effective pixel region. The color filter layer has a color filter material and the pattern layer has the color filter material. In a planar view with respect to a surface of the first substrate on which the joint member is disposed, the pattern layer is disposed between two portions of the joint member, the two portions being separate from and adjacent to each other. In the planar view, the joint member is not disposed between the pattern layer and an end of the first substrate closest to the pattern layer among ends of the first substrate.