Semiconductor Package with Patterned Dielectric for Adhesion
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Solution Overview
Problem
Semiconductor packaging technologies face challenges such as poor adhesion between ICs and carriers, sidewall chipping, warpage, and die shifting due to manufacturing issues like surface roughness and voids in the die attach material, which affect the reliability and yield of 3D ICs and wafer level packaging.
Innovation Solution
A method involving a temporary carrier with a release layer, a patterned dielectric and conductive redistribution structure, and a die attach material that is extruded to fill concave areas on the surface, enhancing adhesion and reliability by improving the interfacial bonding between the semiconductor die and the redistribution structure, and subsequent encapsulation to manage stress and ensure secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional die attach methods are used, then manufacturing process is simple, but adhesion between IC and carrier is poor and voids form
Solution Approach 1:
The carrier surface is pre-patterned with recessed areas before die attachment. This preliminary action allows the die attach material to be extruded into these recesses, creating mechanical interlocking and improving adhesion without requiring complex post-attachment processes.
Solution Approach 2:
The carrier surface is not uniform but has localized recessed areas positioned specifically where die attach material will be applied. This local variation in surface topology concentrates the adhesion enhancement where it is most needed, improving overall bond strength while maintaining process simplicity.
2Reliability
If die attach material is applied to fill surface irregularities, then adhesion improves, but surface roughness and voids increase
Solution Approach 1:
Rather than attempting to smooth the entire carrier surface, the invention creates localized recessed areas only where die attach material will be placed. This approach improves interfacial bonding at specific critical locations while maintaining overall surface planarity and avoiding widespread roughness issues.
Solution Approach 2:
The invention converts what would normally be considered a defect (surface irregularities) into a beneficial feature by intentionally creating controlled recessed areas. These recesses capture the die attach material and extrusion, transforming potential void-forming irregularities into adhesion-enhancing mechanical interlocks.
3Reliability
If extrusion of die attach material is increased to fill concave areas, then adhesion improves, but voids and surface defects increase
Solution Approach 1:
The recessed areas are strategically positioned and sized to match the die attach material application pattern. This localized approach ensures that material extrusion occurs only where needed to fill recesses and create bonding, rather than causing uncontrolled void formation across the entire interface.
Solution Approach 2:
The recessed areas are pre-formed in the carrier before die attachment, establishing defined cavities that will accommodate the extruded die attach material. This preliminary structuring guides the material flow and extrusion process, ensuring that material is deposited where it will create bonding rather than forming voids.
4Shape
If conventional packaging is used, then device size is small, but warpage and die shifting occur
Solution Approach 1:
The carrier is pre-patterned with recessed areas that will receive and anchor the die attach material. This preliminary structuring ensures that when the die is attached, the material has defined pathways for extrusion and bonding, preventing die shifting and reducing warpage without requiring larger device dimensions.
Solution Approach 2:
The recessed areas create localized zones of enhanced adhesion at critical bonding interfaces. This concentrated adhesion enhancement provides sufficient mechanical stability to prevent warpage and die shifting in compact device configurations, eliminating the need for larger packaging to achieve stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the adhesion between the semiconductor die and the redistribution structure, reducing voids and surface roughness, thereby enhancing the reliability and yield of semiconductor packages by up to 10-50% and minimizing manufacturing defects like sidewall chipping and warpage.
Implementation Method 1
A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure with a die attach material interposed therebetween
Data Source
AI summary
A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure through a die attach material, where a thickness of a portion of the die attach material filling a gap between the rear surface of the semiconductor die and a recessed area of the patterned dielectric layer is greater than a thickness of another portion of the die attach material interposed between the rear surface of the semiconductor die and a non-recessed area of the patterned dielectric layer. An insulating encapsulant is formed on the patterned dielectric layer of the first redistribution structure to cover the semiconductor die and the die attach material. Other methods for forming a semiconductor package are also provided.