Semiconductor Substrate Peeling Layer Exposure Prevention
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Solution Overview
Problem
The increased size of semiconductor substrates during flexible semiconductor device manufacturing leads to difficulties in peeling operations, resulting in waste generation and peeling failures due to exposed peeling layers, which complicates the process and increases production costs.
Innovation Solution
The method involves configuring the semiconductor substrate with island-shaped peeling layers and a layer to be peeled, applying dividing treatments to prevent peeling layer exposure, and using a supporting material to buffer the peeling process, ensuring the peeling layer is not exposed during division, thus preventing waste and peeling failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of the first semiconductor substrate is increased to form more semiconductor devices, then productivity is improved, but the difficulty of operation worsens during peeling operations
Solution Approach 1:
The first semiconductor substrate is divided into multiple second semiconductor substrates through a dividing treatment that cuts along sections where the substrate and layer to be peeled are in contact. This segmentation reduces the size of individual substrates to manageable dimensions while maintaining high productivity by processing multiple devices simultaneously on the larger first substrate.
2Ease of operation
If a dividing treatment is carried out to cut across the peeling layer section, then the substrate size is reduced for easier handling, but waste generation increases due to peeling of films
Solution Approach 1:
The dividing treatment is applied selectively to specific sections of the first semiconductor substrate where the substrate and layer to be peeled are in contact, rather than cutting across the entire substrate including the peeling layer section. This localized approach reduces substrate size for easier handling while avoiding exposure of the peeling layer that would cause film peeling and waste generation.
3Manufacturing precision
If additional cleaning is carried out to remove waste adhering onto the layer to be peeled, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The dividing treatment is designed to prevent waste generation in the first place by avoiding exposure of the peeling layer section during substrate division. This preliminary preventive measure eliminates the need for subsequent cleaning operations to remove waste, thereby maintaining manufacturing precision while reducing production process complexity and costs.
Data Source
AI summary
A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.