Semiconductor Device Penetrating Electrode Compact Packaging
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Solution Overview
Problem
Current semiconductor device packaging technologies face challenges in achieving compact, thinner, and more integrated designs while maintaining reliable electrical connections and minimizing heat-related issues in tridimensional structures.
Innovation Solution
The semiconductor device employs a second penetrating electrode that protrudes from the second substrate to reduce the distance and volume of the conductive member, allowing for a finer pitch and lower connection resistance, and uses copper plating for high thermal conductivity and reliability, with solder bumps connecting the substrates and enhancing adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder bumps are used to electrically connect substrates in a stacked configuration, then electrical connectivity between substrates is achieved, but the device size and thickness increase
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical connections by having the penetrating electrode extend through the thickness of the substrate. This allows electrical connectivity to be achieved in the vertical dimension rather than requiring lateral expansion, enabling compact stacked configurations while maintaining reliable electrical pathways between multiple substrates.
Solution Approach 2:
The penetrating electrode is embedded within the substrate structure, with the electrode nested inside the substrate body and extending from one surface to the other. This nested configuration allows the electrical connection pathway to be integrated within the substrate volume rather than occupying additional external space, reducing overall device size while maintaining connectivity.
2Reliability
If conventional electrical connection structures are used between substrates, then electrical connectivity is established, but heat management becomes difficult in the compact structure
Solution Approach 1:
The penetrating electrode serves dual functions: it provides electrical connectivity between substrates and acts as a thermal conduction pathway. By using the same structural element for both electrical and thermal management, the design achieves efficient heat dissipation through the vertical connection pathway without requiring separate thermal management components, thereby reducing heat exposure in compact stacked configurations.
3Volume of moving object
If the conductive member volume is reduced to achieve finer pitch, then device compactness improves, but connection resistance may increase
Solution Approach 1:
The patent compensates for reduced conductive member volume by extending the connection pathway in the vertical dimension. The penetrating electrode achieves low connection resistance not through lateral expansion but through optimized vertical conductivity, allowing finer pitch and compactness while maintaining reliable electrical connections through the thickness of the substrate.
4Adaptability or versatility
If multiple substrates are stacked to achieve higher integration, then device functionality increases, but manufacturing complexity increases
Solution Approach 1:
The penetrating electrode is pre-formed within the substrate during substrate fabrication, before the stacking process. This preliminary formation of the electrode structure simplifies subsequent assembly operations, as the electrical connection pathways are already in place and do not require complex post-assembly alignment or connection operations, thereby reducing manufacturing complexity despite increased device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more compact, reliable, and thermally stable package-on-package device with reduced connection resistance and heat exposure during the reflow process, ensuring effective electrical connectivity and enhanced bonding between substrates.
Implementation Method 1
a conductive member formed on one of the first connection pads and electrically connecting an end portion of the second penetrating electrode and the one of the first connection pads
Implementation Method 2
uses copper plating for high thermal conductivity and reliability
Implementation Method 3
with solder bumps connecting the substrates and enhancing adhesiveness
Data Source
AI summary
A semiconductor device including a first substrate having first and second surfaces, multiple first mounting pads formed on the first surface of the first substrate and for mounting a first semiconductor element on the first surface of the first substrate, multiple first connection pads formed on the first surface of the first substrate and positioned on the periphery of the multiple first mounting pads, a second substrate formed on the first substrate and having first and second surfaces, the second substrate having a second penetrating electrode which penetrates through the first and second surfaces of the second substrate, multiple second mounting pads formed on the first surface of the second substrate and for mounting a second semiconductor element, and a conductive member formed on one of the first connection pads and electrically connecting an end portion of the second penetrating electrode and the one of the first connection pads.