Semiconductor Physical Identifier Authentication
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Solution Overview
Problem
Conventional methods for authenticating semiconductor components using binary identifiers are vulnerable to hacking and falsification, compromising security as they rely solely on digital information, which can be easily manipulated.
Innovation Solution
Fabricating a physical identifier with features located indiscriminately on the surface of semiconductor components, mapping these features, and storing the map alongside the binary identifier for enhanced authentication, thereby providing an additional layer of security assurance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a binary identifier is used for authentication, then the authentication process is simple and fast, but the security is vulnerable to hacking and falsification
Solution Approach 1:
The patent combines two types of identifiers: a binary identifier (digital) and a physical identifier (analog). The physical identifier consists of a region with features located indiscriminately on the surface, which is mapped and stored. During authentication, both the binary identifier and the physical identifier (through its map) are used to verify the semiconductor component's identity, making it extremely unlikely for impostors to forge a matching combination.
Solution Approach 2:
The authentication system uses a composite identification approach where the physical identifier region (with its unique feature distribution) is combined with the binary identifier. This composite approach creates a more secure authentication mechanism than either identifier alone, as the physical identifier's indiscriminate features are difficult to replicate without the corresponding binary identifier.
2Device complexity
If only a binary identifier is used, then the system complexity is low, but the risk of identity compromise is high
Solution Approach 1:
The authentication system is segmented into two independent but complementary parts: the binary identifier (stored in memory) and the physical identifier (formed by the region with indiscriminate features). Each part handles a portion of the authentication burden, and both must align for successful verification, reducing the risk of complete identity compromise.
Solution Approach 2:
The physical identifier acts as an intermediary layer between the binary identifier and the authentication decision. Instead of relying solely on the binary identifier, the system introduces the physical identifier as a mediating factor that must also match, thereby reducing the harmful effect of potential binary identifier falsification.
3Reliability
If a physical identifier with indiscriminate features is fabricated, then the security against falsification is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The physical identifier region is fabricated during the semiconductor component manufacturing process, specifically during the encapsulation step. The region with indiscriminate features is created as part of the encapsulant material formation, and its map is generated and stored in advance. This preliminary action integrates the physical identifier creation into the existing manufacturing flow, minimizing additional complexity.
Solution Approach 2:
The patent changes the parameter of identifier formation from purely digital (binary) to include physical/analog features (region with indiscriminate features). By fabricating the physical identifier as part of the encapsulant material properties, the system enhances security while managing manufacturing complexity through material parameter control rather than complex mechanical processes.
Data Source
AI summary
This document describes techniques for authenticating an identity of a semiconductor component using a physical identifier. In some aspects, a physical identifier comprised of a region of features located indiscriminately within a surface of an encapsulated semiconductor component is fabricated. The physical identifier is then mapped. The map is then stored for use when authenticating the identity of the semiconductor component.