Semiconductor Package Pickup Using a Protrusion Roller to Reduce Adhesion

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Solution Overview

Problem

The increasing complexity and functionality of semiconductor structures require efficient methods to handle large-size semiconductor packages without vacuum environments, addressing issues such as warpage and adhesion during pick-up processes.

Innovation Solution

A pickup apparatus with a roller having protrusions is used to deform and peel off the holding element from the semiconductor packages, reducing contact area and facilitating pick-up without vacuum, thereby minimizing warpage impacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a vacuum environment is used for pick-up, then adhesion is improved, but device complexity and cost increase

Engineering Contradiction:

ImproveadhesionVSAvoidvacuum environment requirement

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the vacuum-based mechanical adhesion system with a chemical adhesion system using a release agent. The release agent creates a release bond between the carrier and semiconductor package, eliminating the need for vacuum environments while maintaining reliable adhesion during transport and processing.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the adhesion mechanism from physical (vacuum suction) to chemical (release agent bonding). By introducing the release agent as an intermediate layer, the adhesion parameters are fundamentally altered to work without vacuum, thereby reducing device complexity while maintaining reliability.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If large-size semiconductor packages are handled, then functionality is improved, but warpage and adhesion issues worsen

Engineering Contradiction:

Improvehandling capabilityVSAvoidwarpage and adhesion problems

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a release agent as an intermediary layer between the carrier and the semiconductor package. This intermediary controls the adhesion characteristics, allowing large packages to be handled without excessive warpage or adhesion problems. The release agent mediates the interaction between carrier and package, enabling safe handling of large-size devices.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The release agent provides localized adhesion control at the interface between carrier and semiconductor package. By applying the release agent only where needed (on the carrier surface), the patent achieves selective adhesion that prevents warpage and adhesion issues specific to large-size packages while maintaining handling capability.

Inventive Principle:

Principle #3Local quality

3Productivity

If pick-up efficiency is increased, then productivity is improved, but warpage impacts worsen

Engineering Contradiction:

Improvepick-up efficiencyVSAvoidwarpage impacts

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces vacuum-based mechanical pick-up with a chemical bond-based system using release agents. This substitution enables faster pick-up operations without the warpage-inducing forces associated with vacuum suction, thereby improving productivity while reducing warpage impacts on semiconductor packages.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances the efficiency of large-size semiconductor package pick-up by reducing adhesion and warpage issues, improving the pick-up process without the need for vacuum environments.

Implementation Method 1

the roller includes a body and a plurality of protrusions distributed over the body... moving the roller to at least separate first portions of the adhesive film from the semiconductor package

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

removing the semiconductor package from second portions of the adhesive film via the collector element... reducing adhesion and warpage issues

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12463067B2Pickup apparatus and method of using the same

Publication Date: 2025.11.04 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between the platform and the semiconductor package. The roller is disposed inside the platform and under the adhesive film, where the roller includes a body and a plurality of protrusions distributed over the body. The moving mechanism is connected to the roller to control a movement of the roller. The collector element is disposed over the platform and the adhesive film, where the collector element is configured to remove the semiconductor package from the adhesive film.