Semiconductor Package Piercing Electrode Ring Concave Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The difference in thermal expansion coefficients between semiconductor substrates and wiring boards in conventional semiconductor packages leads to stress generation and potential cracking at connecting points when heat is applied.
Innovation Solution
A semiconductor package design featuring a semiconductor device with a piercing electrode and a ring-shaped concave part on the semiconductor substrate, allowing the connecting terminal to move slightly and reducing stress, along with a manufacturing method that forms piercing holes, electrodes, and concave parts to achieve this configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor device is mounted on a wiring board using conventional connecting structures, then electrical connection is achieved, but stress concentrates at the connecting terminal interface due to thermal expansion difference, leading to crack generation
Solution Approach 1:
The patent introduces a ring-shaped concave part at the specific location surrounding the connecting terminal, creating a localized stress relief zone. This concave structure redistributes the thermal stress away from the critical connecting terminal interface, preventing crack initiation while maintaining electrical connection reliability. The concave part acts as a stress buffer zone that accommodates differential thermal expansion between the semiconductor substrate and wiring board.
2Stability of the object's composition
If the connecting terminal is rigidly fixed between semiconductor substrate and wiring board, then stable electrical connection is maintained, but thermal stress cannot be relieved during temperature changes, causing interface cracking
Solution Approach 1:
The ring-shaped concave part is pre-formed in the semiconductor substrate before mounting, creating an advance stress buffer zone. This preemptive structural feature allows the connecting terminal to accommodate thermal expansion differences without generating excessive stress, effectively cushioning against future thermal cycling damage while maintaining connection stability.
3Strength
If a rigid connecting structure is used to ensure mechanical strength, then assembly robustness is improved, but stress concentration occurs at the interface during thermal cycling, leading to cracks
Solution Approach 1:
The patent modifies the geometric parameters of the semiconductor substrate by introducing a ring-shaped concave part with specific dimensions. This structural parameter change creates a stress distribution pattern that reduces peak stress at the connecting terminal interface while maintaining overall mechanical strength. The concave part's depth and width are optimized to balance stress relief with structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces stress at connecting points, preventing cracks and improving high-frequency characteristics by allowing the connecting terminal to move and distributing strain away from critical interfaces.
Implementation Method 1
a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device
Implementation Method 2
the coefficient of thermal expansion of glass epoxy, which can be used as the insulation layer 530, is approximately 18 ppm/° C. The coefficient of thermal expansion of silicon, which can be used as the semiconductor substrate 410, is approximately 3 ppm/° C. Due to such a difference of the coefficients of thermal expansion, when heat is applied to the semiconductor package 300, the wiring board 500 is warped more than the semiconductor substrate 410
Implementation Method 3
stress generated at a connecting part configured to connect a semiconductor device and a wiring board in a case where heat is applied to the semiconductor package is eased so that generation of cracks is prevented
Data Source
AI summary
A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.