Semiconductor Package Pillar Cooling for Miniaturized Heat Dissipation
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Solution Overview
Problem
The miniaturization of semiconductor devices poses a challenge in heat dissipation, as excessive operating temperatures can decrease the reliability and lifetime of the die, necessitating improved heat transfer solutions.
Innovation Solution
The semiconductor device design incorporates a plurality of pillars on the semiconductor package to dissipate heat through conduction, with a lid featuring inflow and outflow channels for coolant flow, enhancing heat dissipation efficiency while simplifying the structure and assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor device is miniaturized to reduce size, then the device dimensions are reduced, but heat dissipation becomes more difficult and operating temperature increases
Solution Approach 1:
The heat dissipation function is segmented into multiple independent heat dissipation pillars distributed across the semiconductor package. Each pillar independently conducts heat from the die to the heat dissipation structure, distributing the thermal load and improving overall heat dissipation efficiency in the miniaturized device.
Solution Approach 2:
Heat dissipation pillars are introduced as intermediary structures between the heat-generating die and the heat dissipation structure. These pillars serve as thermal conduits that efficiently transfer heat from the die to the external heat dissipation structure, solving the heat dissipation problem in miniaturized devices.
2Temperature
If heat dissipation structures are added to improve cooling, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation pillars serve multiple functions: they provide thermal conduction pathways, act as mechanical support structures, and facilitate alignment between the die and heat dissipation structure. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity.
Solution Approach 2:
The heat dissipation function is merged with the existing package structure by integrating pillars into the package substrate. This integration approach combines heat dissipation capabilities with the structural framework, avoiding the need for separate, complex cooling systems.
3Temperature
If pillars are used for heat dissipation, then heat conduction is improved, but alignment precision between components decreases
Solution Approach 1:
The pillars are strategically positioned at specific locations where heat generation is highest and where thermal conduction paths are most effective. This localized placement optimizes heat conduction while minimizing the impact on overall alignment precision, as pillars are concentrated in critical thermal zones rather than distributed uniformly.
Solution Approach 2:
The pillars are pre-formed and pre-positioned on the package substrate before die attachment. This preliminary placement establishes a stable thermal conduction pathway and provides mechanical reference points that facilitate subsequent alignment operations, thereby reducing the negative impact on manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively improves heat dissipation, maintaining the integrity of the pillars during assembly and reducing alignment offset effects, thereby enhancing the reliability and longevity of the semiconductor device.
Implementation Method 1
a plurality of pillars disposed on the semiconductor package and adapted to dissipate heat through conduction
Implementation Method 2
The lid includes an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid
Data Source
AI summary
A semiconductor device including a substrate, a semiconductor package, a plurality of pillars and a lid is provided. The semiconductor package is disposed on the substrate and includes at least one semiconductor die. The plurality of pillars are disposed on the semiconductor package. The lid is disposed on the substrate and covers the semiconductor package and the plurality of pillars. The lid includes an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid. An inner surface of the lid, which faces and overlaps the plurality of pillars along a stacking direction of the semiconductor package and the lid, is a flat surface.