Semiconductor Package Pillars With Differential Passivation Openings
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Solution Overview
Problem
The miniaturization of semiconductor packages has led to a deterioration in the reliability and durability of bumps, necessitating a solution to enhance the bonding force testing capability.
Innovation Solution
A semiconductor package design featuring a passivation layer with varying opening sizes to accommodate pillars of different widths, allowing for precise testing of bonding forces through a bump shear test, while protecting non-tested pillars within smaller openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of bumps is reduced to achieve miniaturization of semiconductor packages, then the size of the package is reduced, but the reliability and durability of the bumps deteriorate
Solution Approach 1:
The passivation layer is configured with different opening sizes at different locations: smaller openings for non-tested pillars and larger openings for tested pillars. This local differentiation allows the structure to provide protection where needed while enabling testing where required, resolving the contradiction between miniaturization and reliability testing capability.
2Ease of manufacture
If uniform openings are provided in the passivation layer for all pillars, then manufacturing is simplified, but the capability to test bonding force of specific pillars is lost
Solution Approach 1:
The passivation layer incorporates openings of different sizes at different locations corresponding to different pillars. This local variation enables selective access to specific pillars for bonding force testing while maintaining protection for other pillars, thus achieving both manufacturing feasibility and testing precision.
3Measurement precision
If all pillars are exposed for testing, then bonding force testing is comprehensive, but non-tested pillars are vulnerable to damage
Solution Approach 1:
The passivation layer provides differential protection by having smaller openings for non-tested pillars (providing protection) and larger openings for tested pillars (enabling testing). This local quality differentiation allows comprehensive testing capability while protecting non-tested pillars from damage.
Solution Approach 2:
The passivation layer is segmented into different opening regions: protected regions with smaller openings and tested regions with larger openings. This segmentation allows the structure to simultaneously provide protection for some pillars and testing access for others, resolving the contradiction between comprehensive testing and damage prevention.
Data Source
AI summary
A semiconductor package may include a base, a first chip on the base, and first connection patterns that connect and couple the base and the first chip. The first chip may include a substrate, pad patterns on the substrate, a passivation layer on the substrate and having openings, and pillars on the substrate, the pad patterns include a first signal pad and a second signal pad, the first connection patterns are in contact with the pillars, the pillars include a first signal pillar in contact with the first signal pad and a second signal pillar in contact with the second signal pad, the openings in the passivation layer include a first opening having a sidewall facing a side surface of the first signal pillar and surrounding the side surface of the first signal pillar, and a second opening having a sidewall facing a side surface of the second signal pillar and surrounding the side surface of the second signal pillar, and a maximum width of the second opening is greater than a maximum width of the first opening.