Semiconductor Package Pin Layout for PCB Routing and Heat Dissipation
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Solution Overview
Problem
There is room for optimization in the pin configuration of semiconductor devices to enhance PCB layout efficiency.
Innovation Solution
A semiconductor device with a specific configuration that includes power supply and ground terminals on one side, switch output terminals on another side, and symmetrical placement of these elements across channels, along with a heat radiation pad on the top surface, optimizing the PCB layout and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If power supply terminal and power ground terminal are provided on different sides of the package, then PCB layout flexibility is improved, but thermal resistance increases
Solution Approach 1:
The patent provides power supply terminals and power ground terminals not only on opposite sides (first and second sides) but also on adjacent sides (third and fourth sides) of the package. This multi-dimensional terminal arrangement allows PCB designers to choose from multiple layout configurations, improving flexibility while maintaining short current paths for thermal management.
2Device complexity
If switch output terminals are placed asymmetrically, then device complexity is reduced, but PCB layout optimization is limited
Solution Approach 1:
The patent employs asymmetric placement of switch output terminals relative to the power supply and ground terminals, creating an optimized current path layout. The switch output terminals are positioned to minimize the loop area formed with power supply and ground terminals, reducing electromagnetic interference and improving signal integrity while maintaining a relatively simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved PCB layout and reduced thermal resistance, enhancing heat dissipation and optimizing the semiconductor device's performance.
Implementation Method 1
a thermal resistance over a range from the semiconductor chip sealed in the package to the top surface is smaller than a thermal resistance over a range from the semiconductor chip to a bottom surface of the package
Data Source
AI summary
A semiconductor device comprises: a package including a first side, a second side parallel to the first side, a third side orthogonal to the first side and the second side, and a fourth side parallel to the third side and orthogonal to the first side and the second side; a first power supply terminal and a second power supply terminal either on the first or second side; a first power ground terminal and a second power ground terminal either on the first or the second side; a first switch output terminal and a second switch output terminal on the second side; a first upper switch between the first power supply terminal and the first switch output terminal; a first lower switch between the first switch output terminal and the first power ground terminal; a second lower switch between the second switch output terminal and the second power ground terminal.