Semiconductor Circuit Pin Reconfiguration for Multi-Variant Integration
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Solution Overview
Problem
The existing semiconductor circuit technologies require multiple bonding variants and increased manufacturing, testing, and logistics costs due to the need for different internal electrical pin configurations for each circuit variant, leading to higher unit costs and complexity.
Innovation Solution
The semiconductor circuit employs multiple signal or potential assignments for electrical pins, utilizing switch elements and a selection unit to connect or isolate these pins based on the circuit variant, minimizing the need for multiple bonding variants and reducing costs by using field-effect transistors for switching and shared supply voltage pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sets of internal electrical pins are provided for different circuit variants, then each circuit variant can have its own functional pin assignments, but the chip area increases
Solution Approach 1:
Each electrical pin on the chip surface is designed to serve multiple circuit variants through multiple signal assignments. A single physical pin location can be connected to different functional units depending on the selected circuit variant, eliminating the need for separate pin sets for each variant and thereby reducing chip area.
Solution Approach 2:
The patent introduces switch elements that can dynamically change the connection configuration between electrical pins and functional units based on the selected circuit variant. This dynamic switching capability allows a static physical pin layout to serve multiple functional purposes, resolving the contradiction between pin multiplicity and chip area.
2Adaptability or versatility
If different wiring configurations are implemented for individual circuit variants, then each variant achieves correct signal routing, but manufacturing costs increase due to variant-specific marking
Solution Approach 1:
Switch elements are provided that can be controlled to establish different wiring configurations for different circuit variants. This dynamic reconfigurability allows a single manufacturing process to support multiple circuit variants without requiring variant-specific marking or manual wiring adjustments, thereby reducing manufacturing costs while maintaining full functional capability.
3Adaptability or versatility
If multiple sets of internal electrical pins are provided for different circuit variants, then each variant can be properly tested, but testing costs increase due to multiple testing configurations
Solution Approach 1:
The switch elements that enable dynamic reconfiguration for different circuit variants also facilitate simplified testing. By controlling the switch elements to appropriate positions, a single testing configuration can adapt to test different circuit variants, eliminating the need for multiple dedicated testing configurations and thereby reducing testing costs.
4Adaptability or versatility
If multiple circuit variants are supported with different internal pin configurations, then each variant achieves correct functionality, but logistics costs increase due to multiple part numbers
Solution Approach 1:
The patent implements a universal chip design where a single part number can serve multiple circuit variants. The electrical pins are designed with multiple signal assignments and switch elements that enable the same physical chip to be configured for different circuit variants, thereby reducing logistics costs by eliminating the need to maintain separate part numbers for each variant.
5Adaptability or versatility
If the functional scope is expanded in successor circuit variants, then performance and capabilities are improved, but the number of electrical pins must increase
Solution Approach 1:
The patent enables expanded functional scope in successor circuit variants without increasing the number of electrical pins by implementing multiple signal assignments for each pin. Each pin can be assigned to different functional units depending on the selected circuit variant, allowing functional expansion while maintaining a constant pin count.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the integration of multiple circuit variants in a single semiconductor circuit with a common pin configuration, reducing manufacturing and logistics costs while maintaining compatibility and performance, by dynamically assigning signal or potential connections through switch elements controlled by a selection unit.
Implementation Method 1
switch elements are provided in the semiconductor circuit which connects the first electrical pins to the inputs or outputs of the functional units respectively associated with the circuit variant in use or respectively isolates them
Implementation Method 2
using field-effect transistors for switching
Data Source
AI summary
A semiconductor circuit provides at least one first electrical pin with multiple signal assignment or potential assignment in order to integrate several circuit variants in the semiconductor circuit. It has a switch element for isolating or connecting at least one first electrical pin from or to an input or output of a functional unit integrated in the semiconductor circuit.