Semiconductor Pipe Connect Structure for Tool-Free Fluid Coupling

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Solution Overview

Problem

Traditional fluid connections in semiconductor processing equipment, such as those using flexible metal bands, are time-consuming and inefficient during assembly, disassembly, and reconfiguration, leading to delays in semiconductor fabrication.

Innovation Solution

A connect structure that facilitates the coupling of deformable and non-deformable pipes without tools, utilizing a housing with annular sidewalls and an annular bead made of elastomeric material to securely engage the pipes, allowing for easy rotation and fluid communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional flexible metal bands are used for fluid connections, then reliable fluid communication is achieved, but assembly and disassembly become time-consuming

Engineering Contradiction:
Improvefluid communication reliabilityVSAvoidassembly and disassembly time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The connection system is divided into a rigid pipe portion and a flexible pipe portion that can be independently assembled and disassembled. The rigid portion provides stable fluid communication while the flexible portion enables easy connection without tools, resolving the contradiction between reliability and assembly time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible pipe portion incorporates dynamic elements that allow for easy expansion and contraction during assembly and disassembly. This dynamic flexibility enables rapid connection while maintaining reliable fluid communication once assembled, addressing both requirements simultaneously.

Inventive Principle:
Principle #15Dynamics

2Stability of the object's composition

If traditional fluid connections are used, then stable fluid communication is maintained, but reconfiguration efficiency decreases

Engineering Contradiction:
Improvefluid connection stabilityVSAvoidreconfiguration efficiency
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

By segmenting the connection into rigid and flexible portions, the system maintains stable fluid communication through the rigid portion while allowing rapid reconfiguration through the flexible portion. This segmentation enables frequent reconfiguration without compromising connection stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible pipe portion allows for parameter changes in terms of flexibility and ease of manipulation, enabling rapid reconfiguration. The rigid pipe portion maintains stable fluid communication parameters, thus resolving the contradiction between stability and reconfiguration efficiency.

Inventive Principle:
Principle #35Parameter changes

3Strength

If tool-based assembly methods are used, then secure pipe coupling is achieved, but fabrication delays occur

Engineering Contradiction:
Improvepipe coupling strengthVSAvoidfabrication efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The flexible pipe portion is designed to enable self-service assembly without requiring external tools. The inherent flexibility and elasticity of the material allow operators to securely couple pipes through manual manipulation alone, maintaining coupling strength while eliminating tool-related fabrication delays.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The material parameters of the flexible pipe are optimized to provide sufficient coupling strength through manual assembly alone. The elasticity and flexibility parameters are tuned to allow secure attachment without tools, resolving the contradiction between coupling strength and fabrication efficiency.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables rapid and tool-free assembly of pipes, reducing downtime and enhancing the efficiency of semiconductor fabrication processes.

Implementation Method 1

an annular bead to engage an outer sidewall of the deformable pipe and deform an inner sidewall of the deformable pipe toward the non-deformable pipe structure

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS12562347B2Connect structure for semiconductor processing equipment
Publication Date: 2026.02.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12562347B2 patent drawing
  • US12562347B2 patent drawing
  • US12562347B2 patent drawing

AI summary

A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.