Semiconductor Device Pipe Transistor Connection Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor devices with three-dimensional memory cells require complex and costly manufacturing processes to connect memory blocks and operation circuits efficiently, leading to increased costs and reduced integration density.
Innovation Solution
A semiconductor device with a connection structure that includes a pipe transistor to selectively connect vertical memory strings to common source and bit lines, along with a decoder to generate a block selection signal for transistors, allowing local lines to connect to global lines based on an address signal, thereby simplifying the connection process and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex connection structures are used to connect memory blocks and operation circuits in 3D memory devices, then connection efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The connection structure is divided into local lines within memory blocks and global lines for inter-block connections. Transistors are segmented to selectively connect local lines to global lines based on block selection signals, enabling efficient connection without complex cross-block routing
Solution Approach 2:
Transistors serve as intermediary switching elements between local and global lines. The block selection signal controls these transistors to establish connections only when needed, acting as a mediator that simplifies the overall connection architecture while maintaining efficiency
2Adaptability or versatility
If more transistors are added for selective connection of local lines to global lines, then connection selectivity is improved, but device area increases
Solution Approach 1:
The transistors in the connection circuit serve multiple functions: they act as switching elements for block selection, enable selective connection of local lines to global lines, and maintain low area footprint. This multi-functionality achieves high connection selectivity without proportionally increasing device area
Data Source
AI summary
A semiconductor device includes a first vertical memory string connected to a common source line, a second vertical memory string connected to a bit line, a pipe transistor suitable for selectively connecting the first and second vertical memory strings based on a block selection signal, and a plurality of transistors suitable for selectively connecting local lines of the first and second vertical memory strings to corresponding global lines based on the block selection signal.