Semiconductor Placement Base with Viscous Agent Grooves

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Solution Overview

Problem

Existing placement bases for semiconductor devices do not achieve satisfactory radiatability, which is essential for thermal conductivity and reliability in vehicle equipment.

Innovation Solution

A placement base with a body and protrusions on its periphery, where a radiation agent with viscosity is applied, and detective grooves are provided to ensure effective spreading and retention of the agent between the semiconductor device and the base, enhancing radiatability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a radiation sheet is provided between the semiconductor device and placement base, then radiatability is enhanced, but the radiatability does not reach a satisfactory level

Engineering Contradiction:

ImproveradiatabilityVSAvoidthermal conductivity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The invention changes the physical state of the radiation agent from a simple sheet to a viscous material that can be applied as a coating. This parameter change allows the radiation agent to fill micro-gaps and irregularities between surfaces, significantly improving thermal conductivity while maintaining high radiatability. The viscous property enables the agent to adhere to surfaces and form a continuous thermal path.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention introduces a viscous radiation agent as an intermediary substance between the semiconductor device and placement base. This intermediary serves dual functions: it provides radiation heat transfer capabilities while also improving thermal contact by conforming to surface irregularities, thus resolving the contradiction between radiatability and thermal conductivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a viscous radiation agent is applied to the placement base, then thermal conductivity is improved, but it is difficult to control spreading and prevent leakage

Engineering Contradiction:

Improvethermal conductivityVSAvoidspreading control

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The invention segments the placement base surface into multiple grooves that divide the application area. This segmentation controls the spreading of the viscous radiation agent by creating defined pathways and boundaries, preventing uncontrolled leakage while ensuring uniform distribution. The grooves act as channels that guide the agent to specific areas where it is needed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention applies local quality by providing grooves at specific locations on the placement base surface. These grooves are strategically positioned to control where the radiation agent spreads and accumulates, ensuring optimal thermal contact in critical areas while preventing overflow in other regions. The local structural modification enables precise control over agent distribution.

Inventive Principle:

Principle #3Local quality

3Ease of operation

If grooves are provided on the placement base for introducing the radiation agent, then spreading control is improved, but the structure becomes more complex

Engineering Contradiction:

Improvespreading controlVSAvoidstructure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The invention merges the groove structure with the placement base as an integrated component rather than a separate addition. The grooves are formed directly on the placement base surface, combining the structural support function with the agent distribution function. This integration minimizes additional complexity while achieving effective spreading control.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The groove structure serves multiple functions: it guides the radiation agent, controls spreading, prevents leakage, and may also serve as a mounting feature or alignment guide. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall structural complexity while achieving multiple objectives.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high radiatability and reliable thermal conductivity between the semiconductor device and the placement base, preventing leakage and ensuring uniform spreading of the radiation agent, thereby improving the thermal management of semiconductor devices in vehicle equipment.

Implementation Method 1

enhance thermal conductivity between the semiconductor device and placement base

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

enhances radiatability

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10090218B2Placement base for semiconductor device and vehicle equipment

Publication Date: 2018.10.02 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

A placement base (100) of a semiconductor device (90) comprises a body (10), to which a radiation agent (80) having viscosity is applied and on which a semiconductor device (90) is disposed, and a protrusion (20), which is placed in an outer periphery of the body (10) and on which the semiconductor device (90) is not disposed. A detective groove (30) for introducing the radiation agent (80) is provided on a surface of the protrusion (20).