Semiconductor Placement Head Tilting for Hybrid Bond Alignment
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Solution Overview
Problem
Existing placement tools for semiconductor packaging lack the precision needed for accurate alignment of conductive and dielectric regions, leading to misalignment errors that can cause performance issues and structural damage during hybrid bonding processes.
Innovation Solution
A placement tool with a tilt-able pick-up head and optical beam detection system is used to align semiconductors with the substrate, adjusting for misalignments and ensuring precise contact points before full placement, thereby improving the alignment of conductive and dielectric regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional placement tools are used for semiconductor packaging, then the placement process can be completed, but misalignment errors occur between conductive and dielectric regions leading to performance issues and structural damage
Solution Approach 1:
The patent applies preliminary action by performing alignment verification and contact point detection before the actual bonding process. The system detects potential misalignments in conductive and dielectric regions prior to bonding, allowing corrections to be made before structural damage or performance issues occur during hybrid bonding
Solution Approach 2:
The patent replaces conventional mechanical placement tools with an optical detection system that uses light to verify alignment and identify contact points. This substitution enables non-contact measurement and detection, achieving higher precision without the mechanical errors inherent in traditional placement tools
2Manufacturing precision
If alignment precision is improved through advanced detection systems, then misalignment errors are reduced, but device complexity increases
Solution Approach 1:
The patent introduces an optical beam as an intermediary between the placement tool and the semiconductor components. The optical beam serves as a mediator to detect alignment and contact points without directly contacting the components, simplifying the overall system while achieving high precision through non-contact measurement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the precision of semiconductor placement, reducing misalignment errors and minimizing structural damage, thus improving the electrical interconnection and structural integrity of bonded semiconductor structures.
Implementation Method 1
determining a contact location of the semiconductor onto the substrate
Data Source
AI summary
A placement tool is provided for accurately positioning a semiconductor chip onto a wafer. The tool includes a pick-up head to releasably hold the chip, a robotic arm to move the head, and a stepper motor to drive the arm. A controller operates the tool to move the chip over the wafer, lower it to a specific height, and tilt it to a set angle. The tool emits an optical beam toward an alignment pattern in the chip to determine the initial contact point and detect any misalignment. The controller then adjusts the chip's position to correct the misalignment and lowers the chip to make first contact at the corrected location.