Semiconductor Placement Evaluation Using RL Clustering Rewards

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Solution Overview

Problem

The current semiconductor design process is labor-intensive and varies in quality based on engineer experience, with high complexity in evaluating the placement of tens to millions of semiconductor devices, leading to inefficiencies and increased time and cost.

Innovation Solution

A reinforcement learning-based method that clusters semiconductor devices based on connection information, converts hypergraph structures to ordinary graphs, and trains a neural network model to optimize placement by determining rewards for wire length and congestion, reducing the complexity of the evaluation process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If reinforcement learning with clustering is applied to evaluate semiconductor device placement, then evaluation complexity is reduced, but the accuracy of placement evaluation may be compromised due to clustering approximations

Engineering Contradiction:
Improveevaluation complexityVSAvoidplacement evaluation accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent divides the semiconductor devices into multiple clusters based on spatial proximity and connection relationships. Each cluster is evaluated as a group rather than individually, segmenting the overall evaluation problem into smaller sub-problems that can be processed more efficiently by the reinforcement learning model.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a simplified representative model of each cluster that captures the essential characteristics (wire length, congestion, connection patterns) without requiring detailed evaluation of every individual device within the cluster. This copying approach maintains evaluation accuracy while reducing computational complexity.

Inventive Principle:
Principle #26Copying

2Loss of time

If the number of semiconductor devices to be evaluated is reduced through clustering, then evaluation time is reduced, but the detail information of individual device connections may be lost

Engineering Contradiction:
Improveevaluation timeVSAvoidconnection detail information
Core Design Contradiction:
Loss of timeVSLoss of information

Solution Approach 1:

The patent preserves detailed connection information within each cluster by maintaining local evaluation metrics such as intra-cluster wire length and congestion. While clusters are evaluated as groups, the internal structure and connection details are not completely aggregated away but rather preserved at the local level for accurate assessment.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent evaluates clusters at multiple levels: the cluster level for overall placement quality and the device level within clusters for detailed connection information. This multi-dimensional evaluation approach allows simultaneous reduction of evaluation time through clustering while preserving necessary detail information through hierarchical assessment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If neural network model training is performed with clustered data, then training efficiency is improved, but the model's ability to capture fine-grained placement patterns may be reduced

Engineering Contradiction:
Improvetraining efficiencyVSAvoidplacement pattern accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent employs a dynamic evaluation approach where the reinforcement learning model adapts its evaluation granularity based on the placement stage and device type. During training, the model learns to evaluate both cluster-level patterns and device-level details as needed, dynamically adjusting the level of detail examined rather than using a fixed granularity throughout the training process.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent combines cluster-level evaluation metrics (wire length, congestion, density) with device-level connection information in the training data fed to the neural network. This merging of aggregated and detailed information allows the model to learn from both the big picture placement patterns and fine-grained connection relationships simultaneously, improving both training efficiency and pattern recognition accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11854916B2Method for evaluating placement of semiconductor devices
Publication Date: 2023.12.26 MAKINAROCKS CO LTD
  • US11854916B2 patent drawing
  • US11854916B2 patent drawing
  • US11854916B2 patent drawing

AI summary

Disclosed is a method of evaluating placement of semiconductor devices performed by a computing device according to an exemplary embodiment of the present disclosure. The method includes receiving connection information representing a connection relationship between semiconductor devices; clustering the semiconductor devices based on the connection information; and determining a reward to train a neural network model based on clustering.