Semiconductor Device Plate-Shaped Component Signal Routing
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Solution Overview
Problem
Existing semiconductor device technologies face limitations in chip size flexibility, signal transmission reliability, and manufacturing stability due to restrictions in electrode pad formation and rigidity, particularly in multichip stack structures using anisotropic conductive resins and insulating films.
Innovation Solution
A semiconductor device with a plate-shaped component, including a silicon spacer with through electrodes and interconnects, allows for flexible chip size combinations and improved signal transmission by connecting electrode pads via shorter paths and providing rigidity for stable wire bonding, regardless of chip size or configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional multichip stack structure using anisotropic conductive resin is employed, then electrical connection between chips is achieved, but the resin component melts and disperses conductive balls during pressing, causing unreliable and slow signal transmission
Solution Approach 1:
The patent extracts and removes the problematic resin component from the connection structure. Instead of using anisotropic conductive resin with conductive balls that melt and disperse during pressing, the invention directly connects electrode pads through the plate-shaped component's through electrodes, eliminating the intermediate resin material that causes signal transmission delays and reliability issues.
Solution Approach 2:
The plate-shaped component serves as a rigid intermediary structure that provides stable electrical connection between the first and second semiconductor chips. Through electrodes formed in the plate-shaped component create direct conductive paths, replacing the unreliable resin-based connection while maintaining mechanical support and alignment between chips.
2Ease of operation
If electrode pads are formed on the side region of the first semiconductor chip for external connection, then wire bonding is enabled, but the chip size and configuration are restricted by the need for side region availability
Solution Approach 1:
The patent extends the connection interface to a new dimension by forming electrode pads on the projecting portion of the plate-shaped component that protrudes from the side region. This allows wire bonding to be performed on the extended portion without requiring additional side region space on the semiconductor chip itself, thereby enabling wire bonding capability while maintaining full chip size flexibility.
Solution Approach 2:
The plate-shaped component's projecting portion automatically provides the necessary space and structure for electrode pad formation and wire bonding. The component serves its dual function of electrical connection between chips and providing an extended interface for external connections, eliminating the need to restrict chip design for bonding purposes.
3Adaptability or versatility
If a plate-shaped component with projecting portion is used to extend electrode pads outside the second semiconductor chip, then chip size flexibility is improved, but the structure becomes more complex
Solution Approach 1:
The plate-shaped component is designed to perform multiple functions simultaneously: it provides mechanical support between chips, establishes electrical connections through through electrodes, extends the connection interface via the projecting portion, and enables both wire bonding and other external connection methods. This multi-functionality reduces the need for additional separate components, thereby managing complexity while achieving versatility.
4Reliability
If through electrodes are formed in the plate-shaped component to connect electrode pads, then signal transmission path is shortened and reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Through electrodes are formed in the plate-shaped component before the semiconductor chips are mounted. This preliminary formation allows for controlled manufacturing processes and precise positioning of the electrodes within the plate structure, reducing the precision requirements during the chip assembly process. The electrodes are pre-positioned and secured in the plate, which then serves as a stable foundation for chip mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and speed of signal transmission between semiconductor chips, offers greater freedom in chip size selection and interconnect arrangement, and ensures structural stability during manufacturing, reducing the need for customized chips and lowering manufacturing costs.
Implementation Method 1
when an anisotropic conductive resin 1007 is employed, and the resin component 1070 thereof is first melted
Implementation Method 2
the plate-shaped component includes a through electrode for connecting the first electrode pad and the second electrode pad
Data Source
AI summary
The invention provides a semiconductor device including a plurality of stacked semiconductor chips, which offers a higher degree of freedom in selecting a chip size of the semiconductor chip and arranging the routing, and increase of the reliability and speed in signal transmission between the semiconductor chips. The semiconductor device includes a lower semiconductor chip, an upper semiconductor chip and a silicon spacer formed between the lower semiconductor chip and the upper semiconductor chip and including a projecting portion projecting farther outward than an outer periphery of the upper semiconductor chip, and the silicon spacer includes through electrodes and reroutings.