Semiconductor Plate Electrode with Half-Cut Segmentation
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Solution Overview
Problem
Existing semiconductor device connecting techniques, such as wire bonding and direct lead bonding, face challenges with increased complexity and cost as the number of chips on a substrate grows, particularly in high-temperature applications like SiC devices, due to varying solder thickness and the need for complicated bending processing.
Innovation Solution
A semiconductor device utilizing a plate electrode with half-cut and embossed portions that are bonded to semiconductor chips, eliminating the need for complex bending and reducing manufacturing steps, allowing for uniform solder thickness and improved heat cycle properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect multiple semiconductor chips, then connections can be made between chips, but the number of wires increases and productivity is lowered
Solution Approach 1:
Multiple individual wire connections are merged into a single plate electrode structure that connects to multiple chips simultaneously. The plate electrode integrates multiple connection functions into one component, reducing the total number of separate connections required and enabling parallel processing during assembly.
Solution Approach 2:
The plate electrode serves multiple functions: it provides electrical connections to multiple chips, acts as a heat dissipation component, and serves as a structural support element. This multi-functionality eliminates the need for separate connection components for each chip.
2Reliability
If direct lead bonding is used with multiple chips, then connections can be made, but complicated bending processing is necessary increasing manufacturing cost
Solution Approach 1:
The plate electrode is designed with pre-formed segmentation lines that allow it to be divided into sections corresponding to different chip groups. This segmentation enables independent positioning and bonding for each section without requiring complex overall bending, simplifying the manufacturing process.
Solution Approach 2:
The plate electrode is pre-formed with raised portions and segmentation features before the bonding process. This preliminary shaping eliminates the need for complex bending operations during assembly, as the electrode already has the necessary three-dimensional configuration to accommodate multiple chips on an uneven substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables low-cost production with reduced manufacturing steps and enhanced heat cycle performance, suitable for high-temperature semiconductor devices without increasing complexity or costs, even with multiple chips.
Implementation Method 1
Raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips
Data Source
AI summary
An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and a plate electrode connecting electrodes of the plurality of semiconductor chips. The plate electrode has half-cut portions formed by half-pressing and the raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips.