Semiconductor Lead Frame Plating Defect Prevention
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Solution Overview
Problem
In the manufacturing of resin-sealed semiconductor devices using a lead frame with matrix-arranged device regions, the incidence of unfilled resin defects leads to contamination of the plating solution, resulting in plating defects and reduced reliability of the semiconductor devices.
Innovation Solution
A method that includes a lead frame preparation with matrix-arranged device regions, die bonding, resin sealing, and a subsequent inspection and removal of defective products before plating, ensuring only non-defective devices are plated, thereby preventing contamination of the plating solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin sealing step is performed without intermediate inspection, then the manufacturing process is continuous and efficient, but unfilled defects cause plating solution contamination and plating defects
Solution Approach 1:
The patent applies preliminary action by performing inspection and removing defective products with unfilled defects before the plating step. This prevents contamination of the plating solution while maintaining process efficiency. The defective product removal is done in advance, so that only non-defective products proceed to plating, eliminating the need for complex in-process monitoring during plating.
2Reliability
If defective products are removed after plating, then the plating solution remains clean, but plating defects have already occurred reducing device reliability
Solution Approach 1:
The patent performs inspection and defective product removal between the resin sealing step and the plating step, which is a preliminary action before plating occurs. This timing is optimal because it prevents plating defects from occurring in the first place, rather than detecting them after plating has already consumed time and resources. The loss of time for inspection is minimized by performing it at this specific point in the process flow.
3Productivity
If all device regions are plated regardless of defect status, then production efficiency is maximized, but plating solution contamination occurs from exposed organic protective films and adhesive layers
Solution Approach 1:
The patent extracts and removes defective products with unfilled defects from the manufacturing process before plating. By taking out these problematic items that have exposed organic protective films and adhesive layers, the source of plating solution contamination is eliminated. This allows the remaining non-defective products to be plated without contamination risk, maintaining both productivity and solution integrity.
Solution Approach 2:
The patent converts the potentially harmful effect of defective products into a benefit by using inspection to identify them and removing them selectively. The harmful exposure of organic protective films and adhesive layers in defective products is transformed into a controlled process step where only these defective items are removed, while non-defective items proceed to plating without contamination. This turns a contamination risk into a quality assurance mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability of semiconductor devices by reducing plating defects and maintaining the integrity of the plating solution, enhancing the overall quality and yield of the semiconductor devices.
Implementation Method 1
a lead plating step of plating an outer portion of a lead exposed from the sealing body
Data Source
AI summary
Reliability of a semiconductor device is improved. A method of manufacturing a semiconductor device includes a step of preparing a lead frame in which a plurality of device forming regions are arranged in a matrix, a die bonding step of mounting a semiconductor chip on each device region, a resin sealing step of individually covering each semiconductor chip with a sealing body, and a lead plating step of plating an outer portion of a lead exposed from the sealing body. Between the resin sealing step and the lead plating step, an inspection step for detecting defective products in the resin sealing step and a defective product removal step for removing a device region of defective products are provided.