Semiconductor Plating via Curing Resin Protection

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Solution Overview

Problem

Conventional plating methods for semiconductor devices face challenges with non-uniformity and contamination, particularly when dealing with thin substrates, leading to increased manufacturing costs and inefficiencies in forming stable plating layers on specific surface sides.

Innovation Solution

A method involving the application of a curing resin on one surface electrode, followed by sticking a film and curing it, then plating on the other surface, ensures the plating liquid is contained and prevents contamination, allowing for a stable plating layer formation at a lower cost by enhancing adhesiveness and preventing warping of thin substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If plating is performed on thin semiconductor substrates without protective measures, then plating can be applied to the substrate, but plating liquid contaminates the rear surface and causes non-uniform plating layer formation

Engineering Contradiction:

Improveplating layer uniformityVSAvoidplating liquid contamination

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The substrate surface is segmented into front and rear surfaces with different treatments. The front surface undergoes plating while the rear surface is protected by a resin coating, allowing selective plating on specific regions without contamination

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A resin layer is introduced as an intermediary substance between the plating liquid and the rear surface of the substrate. This resin layer prevents direct contact between the plating liquid and the rear surface, eliminating contamination and non-uniform plating

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the substrate is made thinner to reduce device size, then the overall device dimensions are reduced, but the substrate warps during manufacturing processes

Engineering Contradiction:

Improvesubstrate thicknessVSAvoidsubstrate warping

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The resin layer is applied to the rear surface before plating operations. This preliminary action counteracts the warping tendency by providing mechanical support and stress distribution, preventing deformation during subsequent manufacturing steps

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The substrate structure becomes a composite system combining the thin semiconductor substrate with the resin coating layer. This composite structure provides both the thinness required for small device size and the structural stability needed to prevent warping

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If conventional plating methods are used without protective coatings, then the manufacturing process is simpler, but plating liquid contaminates the rear surface requiring additional cleaning steps

Engineering Contradiction:

Improveplating process simplicityVSAvoidplating liquid waste

Core Design Contradiction:

Ease of manufactureVSLoss of substance

Solution Approach 1:

The resin coating, which initially appears to add process complexity, actually prevents plating liquid contamination. This converts a potential harmful effect (contamination requiring cleaning) into a beneficial outcome (clean substrate without additional cleaning steps)

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The resin layer provides localized protection only where needed (the rear surface), while allowing the front surface to undergo plating. This selective approach prevents contamination without requiring complete process redesign

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents plating liquid contamination and non-uniform plating on the undesired surface, ensuring a stable plating layer on the intended surface side while maintaining cost-effectiveness and preventing substrate warping, thus enhancing the semiconductor device manufacturing process.

Implementation Method 1

applying a curing resin on the second electrode; sticking a film on the curing resin; peeling off the film and the curing resin from the second electrode after the step of plating

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

applying a curing resin on the second electrode; curing the curing resin after sticking the film

Methodology Applied

Scientific EffectCuring: Phase Change

Data Source

PatentUS7947586B2Method of manufacturing a semiconductor device

Publication Date: 2011.05.24 FUJI ELECTRIC CO LTD

AI summary

A method of manufacturing a semiconductor device is disclosed, wherein a plating layer is formed on a first surface side of a semiconductor substrate stably and at a low cost, while preventing the plating liquid from being contaminated and avoiding deposition of uneven plating layer on a second surface side. An electrode is formed on the first surface of the semiconductor substrate, and another electrode is formed on the second surface. A curing resin is applied on the electrode on the second surface and a film is stuck on the curing resin, and the curing resin is then cured. After that, a plating process is conducted on the first surface. The film and the curing resin are then peeled off.