Semiconductor Package Plug Insulation for Signal Integrity
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Solution Overview
Problem
Existing semiconductor packages face electrical interference issues due to insufficient insulation between plugs and semiconductor chips, leading to signal loss when stacked, especially when interposer chips with conductive substrates are used.
Innovation Solution
The semiconductor package design includes a first semiconductor chip with a plug and concentrically arranged insulating holes around it, filled with an insulating member, which enhances electrical isolation between the plug and the chip, and between adjacent plugs, using a method that forms these features during chip manufacturing to prevent signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is formed on the inner surface of the plug hole to electrically isolate the plug from the semiconductor chip, then electrical isolation is improved, but the insulation is insufficient leading to signal loss
Solution Approach 1:
The insulating structure is segmented into multiple components: an insulating layer on the plug hole inner surface, and additional insulating holes formed around the plug. This segmentation allows each insulating component to contribute to the overall electrical isolation, preventing signal loss that cannot be achieved by a single insulating layer alone.
Solution Approach 2:
The insulating holes are formed concentrically around the plug, creating a nested insulating structure where the insulating layer and insulating holes work together in layers. This nested arrangement provides enhanced electrical isolation by surrounding the plug with multiple insulating barriers, effectively preventing signal leakage into the semiconductor chip.
2Adaptability or versatility
If flip chip packages having different sizes are stacked with an interposer chip, then adaptability is improved, but electrical interference occurs in the interposer chip
Solution Approach 1:
The insulating holes act as intermediary elements between the conductive plug and the conductive interposer chip substrate. These insulating holes provide a protective barrier that mediates the electrical interaction, preventing direct electrical interference while maintaining the electrical connection function, thus enabling stacking of different sized packages without interference.
3Reliability
If conductive bumps are used to electrically connect semiconductor chips, then connectivity is improved, but electrical interference between adjacent plugs occurs
Solution Approach 1:
The insulating holes are locally positioned around specific plugs where electrical interference may occur. This local quality approach applies insulation precisely where needed - around each conductive plug - without affecting the overall electrical connection functionality. The insulating holes create localized protective zones that prevent interference between adjacent plugs while maintaining connectivity.
Data Source
AI summary
A semiconductor package may include a package substrate, a first semiconductor chip and a second semiconductor chip. The first semiconductor chip may be arranged on the package substrate. The first semiconductor chip may have a plug electrically connected to the package substrate and at least one insulating hole arranged around the plug. The second semiconductor chip may be arranged on the first semiconductor chip. The second semiconductor chip may be electrically connected to the plug. Thus, the insulating hole and the insulating member may ensure an electrical isolation between the plug and the first semiconductor chip, and between the plugs.