Semiconductor Transport Pod Airtight Sealing for Clean Low-Humidity Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor workpiece transport methods using clean bags or cardboard boxes fail to maintain cleanliness and humidity, are prone to contamination, and lack structural protection, leading to issues with cost and environmental impact.
Innovation Solution
A semiconductor workpiece transport pod with an airtight design featuring an upper cover and airtight strips that form a tight seal with the lower container, combined with an air valve assembly for humidity control and an OHT chuck for automated handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If clean bags or cardboard boxes are used to package semiconductor workpieces, then the packaging is simple and low-cost, but the tightness is insufficient and contamination occurs over extended periods
Solution Approach 1:
The patent employs a flexible airtight strip with an elastic skirt that forms a tight seal between the upper cover and lower container. The elastic material allows the strip to conform to the container surfaces while maintaining airtightness, preventing contamination while remaining simple in design.
Solution Approach 2:
The patent creates a sealed airtight environment within the transport pod that maintains a controlled atmosphere. The airtight strip prevents external contaminants from entering and internal humidity from escaping, preserving the cleanliness and low-humidity state of the semiconductor workpieces throughout transportation.
2Ease of operation
If clean bags are used for packaging, then the packaging is disposable and easy to use, but volatile organic compounds are generated and low-humidity state cannot be maintained
Solution Approach 1:
The transport pod utilizes composite construction with a rigid lower container and upper cover made from materials that do not generate volatile organic compounds, combined with an elastic airtight strip. This composite structure provides both the ease of operation needed for packaging and the chemical stability required to avoid harmful emissions.
Solution Approach 2:
The airtight seal created by the elastic strip maintains a controlled internal environment that prevents moisture exchange with the external atmosphere. This sealed environment preserves the low-humidity state required for semiconductor workpieces while the inert material composition prevents generation of volatile organic compounds.
3Device complexity
If clean bags or cardboard boxes are used, then the packaging is simple, but structural strength is insufficient and workpieces encounter bruises
Solution Approach 1:
The transport pod is divided into a rigid lower container for structural support and protection, and a separate upper cover that provides closure. This segmentation allows the lower container to bear the mechanical loads and protect workpieces from bruises, while the upper cover with the airtight strip provides sealing functionality, distributing the design functions to appropriate structural elements.
4Device complexity
If non-airtight packaging is used, then the packaging is simple and open, but tightness is insufficient and contamination occurs
Solution Approach 1:
The elastic airtight strip with its flexible skirt acts as a deformable sealing element that conforms to the mating surfaces of the upper cover and lower container. This flexible sealing mechanism achieves reliable airtightness while maintaining relatively simple device geometry, as the elasticity of the material provides the sealing force without requiring complex mechanical fastening systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains cleanliness and humidity over extended periods, provides structural protection, and supports repeated use without generating volatile organic compounds, enhancing the transport environment for semiconductor workpieces.
Implementation Method 1
the skirt of the airtight strip is elastically bent and presses tightly against an inner sidewall of the lower container to form airtightness
Data Source
AI summary
A semiconductor workpiece transport pod includes: a lower container, having a top opening; an upper cover, having at least one lateral surrounding groove; and at least one airtight strip, having a base and at least one skirt, the base accommodated in the lateral surrounding groove, the skirt connected to the base and extending outward. When the upper cover is joined with the top opening of the lower container, the skirt of the airtight strip is elastically bent and presses tightly against an inner sidewall of the lower container to form airtightness.