Semiconductor Substrate Polishing Pad with Self-Cleaning Polymer Regions
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Solution Overview
Problem
The polishing pad in semiconductor substrate polishing processes becomes glazed by residue and debris slurry, reducing its lifespan and the flatness of the substrate.
Innovation Solution
A semiconductor substrate polishing apparatus with a polishing pad composed of a first polymer region and multiple second polymer regions, including hydrophilic and hydrophobic areas, and a slurry supply unit, which uses a slurry composition to dissolve and remove residue and debris, maintaining pad integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional polishing pad is used during semiconductor substrate polishing, then the polishing process can be performed, but the polishing pad becomes glazed by residue and debris slurry, reducing its lifespan and substrate flatness
Solution Approach 1:
The polishing pad incorporates multiple polymer regions with different properties: a first polymer region providing structural integrity and a second polymer region with higher solubility that selectively dissolves to remove residue and debris. This local differentiation allows the pad to maintain its shape while enabling self-cleaning functionality to prevent glazing.
Solution Approach 2:
The patent utilizes differences in solubility parameters between the first and second polymers. The second polymer region is designed with higher solubility in the slurry composition, allowing it to dissolve and be carried away by the slurry flow, thereby removing accumulated residue and debris from the pad surface during polishing operations.
2Manufacturing precision
If a conventional polishing pad is used, then polishing can proceed, but flatness of the substrate is reduced due to pad glazing
Solution Approach 1:
The polishing pad incorporates multiple polymer regions with different properties: a first polymer region providing structural integrity and a second polymer region with higher solubility that selectively dissolves to remove residue and debris. This local differentiation allows the pad to maintain its shape while enabling self-cleaning functionality to prevent glazing.
Solution Approach 2:
The polishing pad performs self-conditioning by utilizing the slurry composition to dissolve the second polymer region, which automatically removes residue and debris from the pad surface. This self-cleaning mechanism eliminates the need for external conditioning operations and maintains consistent polishing performance throughout the process.
3Ease of manufacture
If the polishing pad structure is simplified, then manufacturing is easier, but the pad cannot effectively prevent glazing and extend lifespan
Solution Approach 1:
The polishing pad is constructed as a composite material system combining a first polymer providing structural framework and a second polymer providing self-cleaning capability. This composite structure achieves both manufacturing feasibility through standard polymer processing and enhanced performance through the synergistic interaction of different polymer regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents pad glazing, enhances substrate flatness, and extends the polishing pad's lifespan by regularly dissolving and removing residue and debris, thereby improving polishing efficiency.
Implementation Method 1
a slurry supply unit disposed on the polishing table and including a slurry composition, wherein the polishing pad includes a first polymer region defined by first polymers and a plurality of second polymer regions defined by second polymers, adjacent to each other
Implementation Method 2
the polishing pad includes a block copolymer to which a plurality of blocks are chemically bonded, the plurality of blocks include a first polymer block and at least one second polymer block, different from the first polymer block, and the hydrophobic region is defined by the first polymer block, and the plurality of hydrophilic regions are defined by the at least one second polymer block
Data Source
AI summary
An example semiconductor substrate polishing apparatus includes a polishing table, a wafer carrier, and a slurry supplier. The polishing table includes a polishing pad. The wafer carrier is disposed on the polishing table and is configured to attach a substrate. The slurry supplier is disposed on the polishing table and is configured to contain a slurry composition. The polishing pad includes a first polymer region defined by first polymers and a plurality of second polymer regions defined by second polymers, adjacent to each other, and arranged within the first polymer region.