Semiconductor Element Position Pattern for Wafer Coordinate Recognition
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Solution Overview
Problem
The challenge lies in accurately recognizing the position of small Hall elements on a semiconductor wafer before they are cut out, especially when thousands are produced from a single wafer, making it difficult to trace and separate them correctly.
Innovation Solution
A semiconductor element with a pattern indicating its position is formed on the element substrate or its constitution part, using binary numbers represented by the presence or absence of cutout portions in specific regions of a protective film, allowing for precise identification before separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If Hall elements are made small and mass-produced (10,000 or more per wafer), then productivity increases, but position recognition accuracy deteriorates
Solution Approach 1:
The position information is segmented into two separate binary patterns: a first binary pattern indicating the first coordinate value and a second binary pattern indicating the second coordinate value. Each pattern is formed by a separate set of cutout portions, allowing independent recognition of two coordinate dimensions. This segmentation enables accurate position identification even when elements are densely packed
Solution Approach 2:
The position information is encoded in two independent dimensional directions (first coordinate and second coordinate). By using two separate binary patterns oriented in different directions, the system captures position information across multiple dimensions, enabling precise location identification of each Hall element on the wafer surface
2Loss of information
If binary number patterns are formed using cutout portions in protective film, then position information readability improves, but manufacturing process complexity increases
Solution Approach 1:
The binary patterns are formed during the protective film formation process itself, before the Hall elements are separated from the wafer. The cutout portions are created as part of the protective film patterning step, integrating the position encoding into an existing manufacturing operation rather than adding a separate complex process
Solution Approach 2:
The position information is copied into the protective film structure through the binary patterns. Each Hall element's position coordinates are encoded as a copy of the wafer map information, stored in the protective film's cutout pattern, enabling traceability without requiring additional storage media or complex marking systems
Data Source
AI summary
A semiconductor element separated from an original substrate includes: an element substrate; and an element constitution part formed on the element substrate, wherein a pattern indicating a position of the semiconductor element before separating the semiconductor element from the original substrate is formed on at least one of the element substrate and the element constitution part.