Semiconductor Module Positioning Member for Thermal Deformation Compensation

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Solution Overview

Problem

Semiconductor modules face deformation due to differing thermal expansion coefficients and resin curing/contraction, leading to misalignment of external terminals, which complicates attachment to printed boards.

Innovation Solution

A semiconductor device comprising a semiconductor module with a case, external terminals, and a reference pin, along with a positioning member that includes supporting holes for terminals and reference holes for pins, allowing precise alignment and attachment of a printed board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heating and cooling is performed during manufacturing (solder melting, resin curing), then the semiconductor chip is bonded and sealed, but the semiconductor module deforms due to different thermal expansion coefficients

Engineering Contradiction:

Improvebonding strengthVSAvoidpositioning accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

A positioning member is introduced as an intermediary component between the semiconductor module and the printed board. This positioning member maintains stable geometric relationships and compensates for deformations occurring during heating and cooling processes, thereby preserving positioning accuracy despite thermal expansion differences among components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The positioning member is designed in advance with pre-established geometric relationships among its features (reference hole, supporting holes, positioning protrusions). These pre-configured relationships enable the system to maintain accurate positioning even after thermal deformation occurs during manufacturing processes.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If the semiconductor module is deformed during manufacturing, then bonding and sealing are achieved, but the external terminals shift from their proper positions

Engineering Contradiction:

Improvesealing integrityVSAvoidterminal alignment

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The positioning member serves as a mediator that decouples the deformation of the semiconductor module from the positioning requirements of the external terminals. By providing a stable reference framework independent of module deformation, it ensures terminal alignment is maintained despite sealing-induced distortions.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The positioning member is designed to accommodate parameter changes (deformations) in the semiconductor module during manufacturing. Its geometric features are configured to maintain stable spatial relationships even when the module undergoes thermal expansion or resin curing shrinkage, thereby preserving terminal alignment.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If the external terminals are shifted from proper position, then the semiconductor module is assembled, but it becomes difficult to attach the printed board

Engineering Contradiction:

Improveassembly feasibilityVSAvoidattachment difficulty

Core Design Contradiction:

Ease of manufactureVSEase of operation

Solution Approach 1:

The positioning member acts as an intermediary that facilitates the attachment process by providing stable reference features (supporting holes, positioning protrusions) on the printed board. These features enable accurate alignment and secure attachment of the printed board to the semiconductor module, overcoming difficulties caused by terminal position shifts.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The printed board is designed with pre-configured supporting holes and positioning protrusions that correspond to the positioning member's features. This preliminary configuration enables straightforward attachment by simply aligning and securing these pre-matched features, greatly simplifying the assembly process despite any terminal misalignment.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The positioning member corrects terminal misalignment caused by thermal deformation, ensuring secure and accurate attachment of the printed board to the semiconductor module.

Implementation Method 1

different parts included in the semiconductor module have different thermal expansion coefficients. For this reason, the semiconductor module is deformed.

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11562970B2Semiconductor device and manufacturing method thereof

Publication Date: 2023.01.24 FUJI ELECTRIC CO LTD

AI summary

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.