Power Semiconductor Module Positioning Mold for Thermal Paste Homogeneity
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Solution Overview
Problem
Existing methods for positioning and surface treating power semiconductor modules are limited by the need for precise alignment and uniform thermally conductive paste application, which can be challenging due to sensitivity to homogeneity and availability of screen printing methods at the installation site.
Innovation Solution
A molded positioning body with recesses and stop means is used to align and fix power semiconductor modules with high accuracy, allowing for simultaneous surface treatment and application of thermally conductive materials, such as pastes or adhesives, using methods like screen printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermally conductive paste is applied immediately before installation using screen printing methods, then homogeneity of the paste layer is improved, but device complexity and availability of equipment at installation site deteriorates
Solution Approach 1:
The patent applies thermally conductive paste to the power semiconductor modules during a preliminary mounting process before final installation. This preliminary action allows the paste to be applied under controlled conditions with proper equipment available, ensuring homogeneity while eliminating the need for screen printing equipment at the final installation site. The modules are then transported and installed without requiring additional paste application equipment.
2Ease of operation
If power semiconductor modules are arranged in transport packaging with defined distance, then positioning accuracy deteriorates with tolerance of a few millimeters, but ease of transport improves
Solution Approach 1:
The patent performs paste application and other surface treatments as preliminary actions while modules are still in their transport packaging configuration. This allows positioning and treatment to be completed at the relaxed tolerance level suitable for transport, and then the modules can be installed from this pre-positioned state without requiring repositioning equipment.
Solution Approach 2:
The transport packaging serves as an intermediary structure that maintains a defined arrangement of modules with moderate precision suitable for transport. This intermediary configuration allows modules to be handled and processed as a group while maintaining sufficient positioning for subsequent treatment operations, bridging the gap between transport ease and installation precision requirements.
3Temperature
If thermally conductive paste is applied to ensure efficient heat transfer, then heat conduction improves, but sensitivity to homogeneity violation increases
Solution Approach 1:
The paste is applied in advance during the mounting process under controlled conditions where homogeneity can be properly ensured. This preliminary application with adequate time for quality control reduces sensitivity to homogeneity violations during subsequent handling and installation, as the paste layer is already established and can be protected from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves precise positioning with tolerances under 1 mm and ensures uniform coating of power semiconductor modules, facilitating efficient heat transfer and installation without requiring on-site screen printing equipment.
Implementation Method 1
a molded positioning body (10) is proposed which has a planar first main surface (14) and a plurality of recesses (12) for accommodating the power semiconductor modules (40). Each of the recesses (12) has a stop means (20) in the direction normal to the first main surface (14), as a result of which one main surface of a power semiconductor module is positioned plane-parallel and aligned with this first main surface of the positioning shaped body.
Implementation Method 2
screen printing methods are suitable for this purpose, for example, which are not necessarily available at the installation site.
Implementation Method 3
this thermally conductive connection between the substrate and the cooling component is formed by an intermediate layer made of a thermally conductive layer, a so-called thermally conductive paste.
Data Source
Figure 1
Figure 2~3
AI summary
The invention describes a device and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules using a positioning mold that has a flat first main surface and a plurality of recesses for receiving the power semiconductor modules. Each recess has a stop element, whereby a main surface of each power semiconductor module is positioned parallel to and aligned with the first main surface of the positioning mold. The recess is conically tapered, at least in a partial section, from the second main surface towards the first main surface.