Semiconductor Package Power Bar Design for Lead Frame Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages have limited input/output connections due to the design of the lead frame, which restricts the number of leads for mechanical support and electrical connections, necessitating a more advanced solution for increased functionality.
Innovation Solution
The semiconductor package incorporates a lead frame with a power bar that connects multiple power leads, featuring a thicker supporting portion to enhance mechanical strength and avoid dangling issues, while also providing additional bonding regions for design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional lead frame design is used, then the structure is simple and easy to manufacture, but the amount of leads for input/output connections is limited
Solution Approach 1:
The lead frame is divided into distinct functional segments: a die pad for mounting the semiconductor die, multiple leads extending from the die pad for input/output connections, and a power ring surrounding the die pad with integrated power connections. This segmentation allows each component to be optimized independently, enabling increased I/O connections through additional leads while maintaining manufacturing simplicity through standardized segment designs.
2Strength
If the thickness of the supporting portion is increased, then the mechanical strength is enhanced and dangling is avoided, but the manufacturing complexity increases
Solution Approach 1:
The power bar is designed with non-uniform thickness, featuring a thicker supporting portion that contacts the die pad and a thinner terminal portion for electrical connections. This local quality variation provides enhanced mechanical strength and rigidity precisely where needed to prevent dangling, while maintaining ease of manufacture through a single-piece construction that can be formed using standard stamping or etching processes without requiring complex multi-step thickness variations.
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die peddle. A supporting bar connects to the die peddle, extending in an outward direction from the die peddle. At least two power leads are separated from the die peddle and the supporting bar, having first terminals close to the die peddle and second terminals extending outward from the die peddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed.