Semiconductor Module Power Contacts for Coreless Current Sensing
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Solution Overview
Problem
Current sensors with cores occupy space, hinder miniaturization, suffer from core saturation, and have insufficient measurement accuracy in semiconductor modules.
Innovation Solution
A semiconductor module design with overlapping power contacts that allow for a coreless current sensor element to measure combined current, improving signal-to-noise ratio and reducing measurement inaccuracy by aligning current flows in the same direction within overlapping slots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a current sensor with a magnetic core is used, then current measurement is enabled, but the device occupies excessive space and suffers from core saturation
Solution Approach 1:
The patent extracts and eliminates the magnetic core from the current sensor design, transitioning to a coreless sensor element. This removal of the core component directly reduces the sensor's space occupation while enabling alternative measurement approaches that avoid core saturation issues
Solution Approach 2:
The patent utilizes the third dimension by positioning power contacts in overlapping configurations above and below a reference plane. This spatial arrangement creates overlapping slots that accommodate the coreless sensor element, enabling current measurement without requiring lateral space for a magnetic core
2Measurement precision
If a current sensor with a magnetic core is used, then current measurement is enabled, but core saturation occurs reducing measurement accuracy
Solution Approach 1:
By removing the magnetic core entirely and using a coreless sensor element, the patent eliminates the source of core saturation. The sensor measures current through electromagnetic induction in the overlapping slots without relying on magnetic core flux, ensuring reliable measurements even under high current conditions
Solution Approach 2:
The patent changes the operational parameters by utilizing electromagnetic field coupling through overlapping conductive slots rather than magnetic core flux. This parameter change allows the sensor to operate in a regime free from core saturation effects, maintaining measurement reliability across the full current range
3Ease of manufacture
If power contacts are arranged separately without overlap, then manufacturing is simpler, but space efficiency is reduced
Solution Approach 1:
The patent merges the first and second power contacts by arranging them in overlapping configurations. This combining of contact functions into a shared spatial region reduces the overall module footprint while maintaining electrical functionality, and the overlapping slots provide a integrated structure for sensor placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables miniaturization and enhances measurement accuracy by eliminating the need for a magnetic core, reducing core saturation, and improving overcurrent detection.
Implementation Method 1
the overlapping parts comprise overlapping slots configured to accept a current sensor element for measuring a combined current in the overlapping parts
Data Source
AI summary
A semiconductor module includes a semiconductor die, an encapsulation encapsulating the die, and first and second power contacts electrically coupled to the die. The power contacts each include an external part exposed from the encapsulation and an overlapping part. The power contacts are configured to carry respective first and second currents. A current flow of the first current in the external part of the first power contact points into or out of the semiconductor module. A current flow of the second current in the external part of the second power contact points in the opposite direction of the first current flow. The overlapping parts overlap such that the current flows point in the same direction in the overlapping parts. The overlapping parts include overlapping slots configured to accept a current sensor element for measuring a combined current in the overlapping parts.