Semiconductor Power Line Structure With Variable Width Connection Lines
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Solution Overview
Problem
Current semiconductor apparatuses face challenges in efficiently transferring power due to limitations in the design of connection lines between power supply pads and power lines, which hinders high-performance operation within a limited area.
Innovation Solution
The semiconductor apparatus incorporates a specific configuration of connection lines, including first and second connection line modules with varying widths and arrangements, to efficiently connect power supply pads with power lines, allowing for effective power distribution to internal circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If connection lines are made wider to improve power transfer efficiency, then power supply capability is improved, but area occupied by connection lines increases
Solution Approach 1:
The connection line width is optimized locally based on the specific power requirements of different internal circuits. Connection lines supplying power to circuits requiring more power are made wider, while those supplying to circuits requiring less power are made narrower. This local optimization allows efficient power distribution without unnecessarily increasing the total area occupied by all connection lines.
Solution Approach 2:
The width parameter of connection lines is varied according to the power supply needs of different circuits. By changing the width parameter locally rather than using a uniform width, the patent achieves both high power transfer efficiency where needed and minimized total area occupation.
2Adaptability or versatility
If more connection lines are added to supply power to multiple internal circuits, then power distribution capability is improved, but device complexity increases
Solution Approach 1:
The power supply apparatus is designed to serve multiple internal circuits through a shared set of connection lines originating from common power supply pads. This multi-functional design allows the same power supply structure to serve different circuits with different power requirements, reducing the need for separate dedicated connection lines for each circuit and thereby reducing overall device complexity.
Solution Approach 2:
The connection lines are segmented into different width sections to serve different power requirements. Rather than creating separate connection lines for each circuit, the patent segments the width of shared connection lines to optimize power distribution to multiple circuits, reducing the total number of connection lines needed.
Data Source
AI summary
A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of the power supply pad, and including a first power line and a second power line; and connection lines connecting the power supply pad and the power lines. The connection lines may include a plurality of first connection lines connecting the power supply pad and the first power line, and a plurality of second connection lines connecting the power supply pad and the second power line, and disposed between the first connection lines. One or more pair of adjacent first connection lines may have a connection part by which the pair of adjacent first connection lines are connected with each other.