12-in-1 Semiconductor Power Module Edge Terminal Layout
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Solution Overview
Problem
Existing semiconductor power modules for inverter/converter systems in hybrid electric vehicles require complex configurations and high inductance, which limits compactness, mounting ease, and power conversion efficiency, particularly for 12-in-1 modules where all AC terminals are not optimally grouped and inductance needs to be minimized to suppress surge voltage.
Innovation Solution
A 12-in-1 semiconductor power module configuration with two sets of upper and lower arms disposed on either side of an insulated substrate, using multiple wiring patterns for efficient bonding and terminal placement, allowing AC and DC terminals to be grouped optimally and reducing inductance by orthogonal placement of arms and terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a 12-in-1 semiconductor power module is designed with all terminals on the top surface, then mounting compactness is improved, but terminal connection ease deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional top-surface terminal arrangement to a three-dimensional edge-based arrangement. AC terminals are positioned on one end edge and DC terminals on the opposite end edge of the insulated substrate, utilizing the vertical and lateral dimensions of the module rather than confining all terminals to the top surface. This spatial reconfiguration maintains compactness while dramatically improving connection ease by grouping like terminals together.
2Volume of moving object
If DC terminals are disposed at the center of the top surface, then mounting compactness is improved, but control signal line routing flexibility deteriorates
Solution Approach 1:
The patent extracts DC terminals from the center of the top surface and relocates them to the end edges of the insulated substrate. This separation removes the conflict between DC terminal placement and control signal line routing, allowing control lines to be freely arranged on the top surface without being obstructed by centrally located DC terminals, thereby maintaining both compactness and routing flexibility.
3Reliability
If inductance of power circuit is increased, then surge voltage suppression is improved, but power conversion efficiency deteriorates
Solution Approach 1:
The patent employs asymmetric wiring pattern design where the positive terminal wiring extends between the second and third wiring patterns in a specific configuration. This asymmetric arrangement optimizes the current path to minimize loop area and inductance while maintaining adequate surge suppression, breaking the symmetry that would otherwise create larger inductance and energy losses.
Data Source
AI summary
An object of the present invention is to mount, for example, 12 arms compactly on a single semiconductor power module, to dispose DC terminals and AC terminals on an edge of the module and to keep inductance of a power circuit at a low level. According to the invention, two sets of upper arms (100,104 and 102,106) are disposed on the upper right and left sides of an insulated substrate 108, two sets of lower arms (101,105 and 103,107) are disposed on the lower right and left sides of the insulated substrate, the two sets of upper arms are mounted on a first wiring pattern C01 as wiring patterns on the insulated substrate, the two sets of lower arms are mounted respectively on second and third wiring patterns CO2 and CO2 disposed under the first wiring pattern, the first wiring pattern C01 is extended between the second and third wiring patterns, wiring from a positive terminal T01 is connected to the extended end portion, and three insulated substrates 108 are mounted in parallel to constitute a 12-in-1 module.