Semiconductor Power Supply Node Switching for Probe Testing
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Solution Overview
Problem
The existing semiconductor integrated circuit testing methods require multiple probe needles to apply power supply voltage to multiple power supply nodes, increasing costs and noise interference, especially during high-speed operations, and limiting the number of nodes that can be tested simultaneously.
Innovation Solution
A semiconductor integrated circuit device with a switch section that connects and separates power supply nodes during testing and product use, allowing a single probe needle to suffice for testing and reducing noise interference by applying power supply voltage to each node individually in product mode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple power supply nodes are separated to reduce noise interference in product mode, then noise reduction is improved, but the number of probe needles required for testing increases
Solution Approach 1:
The patent applies the dynamics principle by making the power supply node connections changeable between two states: connected during probe testing and separated during product operation. The switch section dynamically reconfigures the power supply architecture based on the operational mode, allowing the system to optimize for either testing efficiency or noise reduction depending on the current phase.
Solution Approach 2:
The patent applies segmentation by dividing the power supply system into multiple separable power supply nodes (first power supply node, second power supply node, etc.) that can be independently controlled. Each node can be connected or disconnected via switch sections, enabling selective power supply to different circuit blocks during product operation to reduce noise interference.
2Reliability
If multiple power supply nodes are separated to reduce noise interference, then power supply reliability is improved, but device complexity increases
Solution Approach 1:
The switch sections provide dynamic control over power supply node connections, allowing the system to transition between connected and separated states based on operational requirements. This dynamic reconfiguration enables the system to achieve both reliability (through separated power supplies in product mode) and simplicity (through connected power supplies during testing).
Solution Approach 2:
The power supply system is segmented into multiple independently controllable nodes with associated switch sections. This segmentation allows selective activation of power supply paths, improving reliability by isolating power domains during product operation while maintaining simplicity during testing by connecting all nodes.
3Measurement precision
If multiple probe needles are used for testing multiple power supply nodes, then measurement precision is improved, but testing cost increases
Solution Approach 1:
The system dynamically connects all power supply nodes during probe testing, enabling a single probe needle to access any node. This dynamic reconfiguration maintains measurement precision by ensuring all nodes are electrically connected to the test interface, while reducing the number of simultaneous probe contacts required, thereby lowering testing costs.
Data Source
AI summary
A semiconductor integrated circuit device includes an internal circuit. A plurality of power supply nodes are connected with the internal circuit, and a plurality of pads are respectively connected with the plurality of power supply nodes. A switch section is configured to connect the plurality of power supply nodes one after another in a probe test mode and to separate the plurality of power supply nodes from each other in a product use mode. A power supply voltage is applied to one of the plurality of pads in the probe test mode, and the power supply voltage is applied to each of the plurality of pads in the product use mode. The switch section may include n switches (n is a natural number) provided for the plurality of power supply nodes.