Semiconductor Power Supply Layout With Split Capacitor Mounting
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Solution Overview
Problem
The existing micro power supply modules occupy a large area due to the side-by-side arrangement of power supply ICs and capacitors, hindering the size reduction of semiconductor devices and increasing costs.
Innovation Solution
A semiconductor device design where the voltage generating circuit and smaller first capacitors are mounted on the module substrate, while larger second capacitors are mounted on the main substrate, allowing for efficient wiring and reducing the size of the circuit module without increasing the module substrate's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power supply IC and capacitors are disposed side by side along the component placement surface, then the power supply circuit can be formed, but the area occupied on the main substrate increases
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked arrangement where the power supply IC is mounted on the module substrate and the capacitors are mounted on the main substrate below it. This vertical stacking in the third dimension (Z-axis) reduces the planar area occupation while maintaining all necessary electrical connections through conductive structures penetrating the module substrate.
Solution Approach 2:
The power supply circuit components are segmented and distributed across two different substrates: the power supply IC remains on the module substrate while the capacitors are separated and mounted on the main substrate. This segmentation allows each component to be optimally positioned, with larger capacitors placed on the main substrate away from the circuit module, thereby reducing the overall area requirement.
2Reliability
If larger capacity capacitors are mounted on the module substrate, then the power supply circuit performance is improved, but the module substrate size increases
Solution Approach 1:
The larger second capacitors are extracted from the module substrate and relocated to the main substrate. This extraction removes the bulkier components from the constrained module substrate environment, allowing the module substrate to maintain a compact size while still achieving the required power supply performance through the combined capacitance of first and second capacitors.
Solution Approach 2:
The solution moves the larger capacitors to a different spatial plane (the main substrate plane) rather than expanding the module substrate. By utilizing the vertical stacking arrangement and placing capacitors on the main substrate beneath the module substrate, the patent achieves high capacitance values without increasing the module substrate's footprint.
Data Source
AI summary
A semiconductor device including a power supply circuit to supply power to a circuit formed on a main substrate equipped with a circuit module is made smaller in size. A semiconductor device includes: a circuit module including a module substrate and a circuit element mounted on the module substrate; and a main substrate on which the circuit module is mounted. The semiconductor device further includes a power supply circuit to supply power to at least a circuit formed on the module substrate. The power supply circuit includes: a voltage generating circuit to output a predetermined output voltage; a first capacitor; and a second capacitor larger in capacity than the first capacitor. The voltage generating circuit and the first capacitor are mounted on the module substrate. The second capacitor is mounted on the main substrate.