Semiconductor Module Pre-Seal Curing for Bubble-Free Housing Seals
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Solution Overview
Problem
Conventional seal formation methods for semiconductor modules face challenges such as air bubble formation, contamination, and reduced sealing abilities due to contaminants in the sealing material, leading to increased costs and longer cycle times, as well as potential interference with module components during the curing process.
Innovation Solution
A method involving a pre-seal formed with a matrix material and an adhesion promoter, where the matrix material is cured at a defined temperature for a specific time, while the adhesion promoter remains inactive, allowing for a pre-seal to be created that is later activated at a higher temperature to ensure secure attachment and sealing without additional fasteners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the sealing material is cured at high temperature to activate adhesion promoter, then adhesion strength is improved, but air bubbles and contamination occur during curing
Solution Approach 1:
The curing process is divided into two separate stages: first curing the matrix material at lower temperature to form a pre-seal, then activating the adhesion promoter at higher temperature in a second step. This segmentation prevents air bubbles and contamination while achieving strong adhesion.
Solution Approach 2:
The matrix material is cured in advance at lower temperature to form a stable pre-seal structure before the adhesion promoter is activated. This preliminary action creates a foundation that prevents defects during the subsequent high-temperature activation phase.
2Strength
If the adhesion promoter is activated during curing, then adhesion strength is improved, but contaminants in sealing material reduce sealing ability
Solution Approach 1:
The curing and adhesion promoter activation are separated into distinct sequential steps. The matrix material cures first to establish reliable sealing, then the adhesion promoter is activated separately to enhance bond strength without compromising seal integrity.
3Reliability
If conventional seal formation methods are used, then sealing is achieved, but costs increase and cycle time lengthens
Solution Approach 1:
The pre-seal formation and adhesion promoter activation are combined into a single two-step process that can be completed in one heating cycle. This merging eliminates the need for separate processing steps, reducing overall cycle time and cost while maintaining reliable sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents air bubbles and contamination, enhances sealing abilities, and reduces costs by allowing for easier handling and secure attachment of the housing to the substrate or base plate, thereby increasing the overall lifetime of the semiconductor module.
Implementation Method 1
the matrix material is configured to cure when heated to a defined temperature for a defined period of time
Implementation Method 2
the adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature
Data Source
AI summary
A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature and/or for a period of time that is longer than the defined period of time. The method further includes heating the first material to the defined temperature for the defined period of time such that the matrix material cures and the adhesion promoter remains inactive, thereby forming a pre-seal.