Power Semiconductor Press-Fit Connection for Inductive Loss Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power semiconductor modules face issues with parasitic inductances and unwanted over-voltages due to fast switching of high currents or high voltages, leading to power loss in connections and modules.
Innovation Solution
A power semiconductor arrangement featuring a press fit connection between plug-like elements and sheet metal strip lines, which reduces inductive losses by aligning openings in the strip lines with the plug-like elements and establishing a secure mechanical connection, thereby minimizing cross currents and enhancing current flow directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional connections are used in power semiconductor modules, then assembly is simple, but parasitic inductances cause power loss and over-voltages
Solution Approach 1:
The connection structure is segmented into multiple plug-like elements (at least two) that are distributed across the sheet metal strip line. This segmentation allows current to be distributed through multiple parallel paths, reducing parasitic inductance and power loss while maintaining a relatively simple overall assembly process.
Solution Approach 2:
The invention transitions from traditional planar connections to a three-dimensional press-fit connection where plug-like elements extend through openings in the sheet metal strip line. This dimensional change enables shorter current paths and better current distribution, reducing parasitic inductance without significantly complicating the assembly process.
2Productivity
If fast switching of high currents is performed, then power semiconductor module operates efficiently, but unwanted over-voltages are generated due to parasitic inductances
Solution Approach 1:
By segmenting the connection into multiple plug-like elements distributed across the strip line, the current path is divided into multiple parallel routes. This reduces the total parasitic inductance, allowing fast switching operations to proceed without generating excessive over-voltages, thus maintaining high switching speeds safely.
3Loss of energy
If press fit connection is established between plug-like elements and sheet metal strip line, then inductive losses are reduced, but assembly precision requirements increase
Solution Approach 1:
The connection is divided into multiple discrete plug-like elements that can be independently positioned and pressed into place. This segmentation allows for modular assembly where each element can be precisely aligned individually, reducing the cumulative alignment errors that would occur in a single complex connection, thereby lowering overall assembly precision requirements while maintaining low inductive losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an easy-to-assemble, low-inductive connection that reduces power loss and minimizes unwanted over-voltages, improving the efficiency of power semiconductor modules by ensuring currents flow in parallel directions with reduced cross currents.
Implementation Method 1
the set of openings in the sheet metal strip line and the set of plug-like elements establish a press fit connection
Data Source
AI summary
A power semiconductor arrangement is provided that includes a power semiconductor chip being electrically connected to a set of plug-like elements with at least two plug-like elements and further including a sheet metal strip line including a set of openings receiving the first set of plug-like elements, where the set of openings in the sheet metal strip line and the set of plug-like elements establish a press fit connection.