Semiconductor Package Pressing Plate for Uniform Stress Control
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Solution Overview
Problem
In semiconductor devices, gaps or overpressurized states between stacked components can occur due to thermal expansion and contraction differences, leading to grease being pumped out and potential creep or crack issues in the resin surface.
Innovation Solution
A semiconductor device design that includes a cooler, a semiconductor package, a metal plate with a flat surface, a spring to apply elastic force, and a fixture to secure the spring, which presses the semiconductor package with a flat surface to distribute stress evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the spring presses the resin surface directly, then the pressing force is applied to maintain contact, but local stress concentration causes creep or crack in the resin
Solution Approach 1:
A pressing plate is introduced as an intermediary component between the spring and the resin surface. The pressing plate distributes the concentrated spring force over a larger area of the resin surface, preventing local stress concentration that would cause creep or crack. The pressing plate acts as a mediator that transforms the point-contact force into a distributed pressure, maintaining the necessary pressing force while protecting the resin integrity.
2Device complexity
If the spring presses the resin surface directly, then the structure is simple, but the stress is not evenly distributed causing localized damage
Solution Approach 1:
The pressing plate serves as a simple intermediary component that significantly improves stress distribution. By adding this single plate element, the concentrated force from the spring is transformed into evenly distributed pressure across the resin surface, preventing localized damage while maintaining structural simplicity.
3Reliability
If grease is applied between the cooling surface and cooler, then the grease prevents pumping out with stable pressing force, but the grease can be pumped out when stress is not evenly distributed
Solution Approach 1:
The pressing plate distributes stress evenly across the resin surface and cooling surface, creating uniform pressure conditions that prevent grease pumping out. When stress is concentrated, grease is forced out through high-stress pathways; the pressing plate eliminates these concentrated pathways by distributing the load, thereby retaining the grease in the interface between the cooling surface and cooler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents local stress application to the semiconductor package, thereby preventing creep or cracks and ensuring stable pressing force, which improves reliability and prevents grease from being pumped out.
Implementation Method 1
a spring that is provided above the main section and presses the main section toward the upper surface of the semiconductor package with an elastic force
Data Source
AI summary
A semiconductor device according to the present invention includes a cooler, a semiconductor package provided on an upper surface of the cooler, a metal plate having a main section provided on an upper surface of the semiconductor package, a spring that is provided above the main section and presses the main section toward the upper surface of the semiconductor package with an elastic force and a fixture that fixes the spring to an upper surface of the main section with the spring exerting the elastic force, wherein a surface, which faces the upper surface of the semiconductor package, of the main section is flat.